34 lines
1.8 KiB
Plaintext
34 lines
1.8 KiB
Plaintext
(module ROHM_VML0806 (layer F.Cu) (tedit 5A02F1D8)
|
|
(descr "VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf)")
|
|
(tags "ROHM VML0806")
|
|
(attr smd)
|
|
(fp_text reference REF** (at 0 -1.3) (layer F.SilkS)
|
|
(effects (font (size 1 1) (thickness 0.15)))
|
|
)
|
|
(fp_text value ROHM_VML0806 (at 0 1.3) (layer F.Fab)
|
|
(effects (font (size 1 1) (thickness 0.15)))
|
|
)
|
|
(fp_line (start 0.1 0.42) (end -0.1 0.42) (layer F.SilkS) (width 0.12))
|
|
(fp_line (start 0.1 -0.42) (end -0.4 -0.42) (layer F.SilkS) (width 0.12))
|
|
(fp_line (start -0.7 0.6) (end -0.7 -0.6) (layer F.CrtYd) (width 0.05))
|
|
(fp_line (start 0.7 0.6) (end -0.7 0.6) (layer F.CrtYd) (width 0.05))
|
|
(fp_line (start 0.7 -0.6) (end 0.7 0.6) (layer F.CrtYd) (width 0.05))
|
|
(fp_line (start -0.7 -0.6) (end 0.7 -0.6) (layer F.CrtYd) (width 0.05))
|
|
(fp_line (start -0.15 -0.3) (end -0.4 -0.05) (layer F.Fab) (width 0.1))
|
|
(fp_line (start -0.4 0.3) (end -0.4 -0.05) (layer F.Fab) (width 0.1))
|
|
(fp_line (start 0.4 0.3) (end -0.4 0.3) (layer F.Fab) (width 0.1))
|
|
(fp_line (start 0.4 -0.3) (end 0.4 0.3) (layer F.Fab) (width 0.1))
|
|
(fp_line (start -0.15 -0.3) (end 0.4 -0.3) (layer F.Fab) (width 0.1))
|
|
(fp_text user %R (at 0 0) (layer F.Fab)
|
|
(effects (font (size 0.127 0.127) (thickness 0.02)))
|
|
)
|
|
(pad 2 smd rect (at -0.3 0.175) (size 0.3 0.25) (layers F.Cu F.Paste F.Mask))
|
|
(pad 1 smd rect (at -0.3 -0.175) (size 0.3 0.25) (layers F.Cu F.Paste F.Mask))
|
|
(pad 3 smd rect (at 0.3 0) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
|
|
(model ${KISYS3DMOD}/Package_SON.3dshapes/ROHM_VML0806.wrl
|
|
(at (xyz 0 0 0))
|
|
(scale (xyz 1 1 1))
|
|
(rotate (xyz 0 0 0))
|
|
)
|
|
)
|