160 lines
9.5 KiB
Plaintext
160 lines
9.5 KiB
Plaintext
(module ST_WLCSP-64_Die462 (layer F.Cu) (tedit 5AE11EAD)
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(descr "WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf")
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(tags "BGA 64 0.4")
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(attr smd)
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(fp_text reference REF** (at 0 -2.8285) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value ST_WLCSP-64_Die462 (at 0 2.8285) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 1.6785 1.8285) (end -1.6785 1.8285) (layer F.Fab) (width 0.1))
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(fp_line (start -1.6785 1.8285) (end -1.6785 -0.98925) (layer F.Fab) (width 0.1))
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(fp_line (start -1.6785 -0.98925) (end -0.83925 -1.8285) (layer F.Fab) (width 0.1))
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(fp_line (start -0.83925 -1.8285) (end 1.6785 -1.8285) (layer F.Fab) (width 0.1))
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(fp_line (start 1.6785 -1.8285) (end 1.6785 1.8285) (layer F.Fab) (width 0.1))
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(fp_line (start -2.68 -2.83) (end -2.68 2.83) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.68 2.83) (end 2.68 2.83) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.68 2.83) (end 2.68 -2.83) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.68 -2.83) (end -2.68 -2.83) (layer F.CrtYd) (width 0.05))
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(fp_line (start -0.96425 -1.9535) (end 1.8035 -1.9535) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.8035 -1.9535) (end 1.8035 1.9535) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.8035 1.9535) (end -1.8035 1.9535) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.8035 1.9535) (end -1.8035 -1.11425) (layer F.SilkS) (width 0.12))
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(pad A1 smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A2 smd circle (at -1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A3 smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A4 smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A5 smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A6 smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A7 smd circle (at 1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A8 smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B1 smd circle (at -1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B2 smd circle (at -1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B3 smd circle (at -0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B4 smd circle (at -0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B5 smd circle (at 0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B6 smd circle (at 0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B7 smd circle (at 1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B8 smd circle (at 1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C1 smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C2 smd circle (at -1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C3 smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C4 smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C5 smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C6 smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C7 smd circle (at 1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C8 smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D1 smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D2 smd circle (at -1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D3 smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D4 smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D5 smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D6 smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D7 smd circle (at 1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D8 smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E1 smd circle (at -1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E2 smd circle (at -1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E3 smd circle (at -0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E4 smd circle (at -0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E5 smd circle (at 0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E6 smd circle (at 0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E7 smd circle (at 1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E8 smd circle (at 1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F1 smd circle (at -1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F2 smd circle (at -1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F3 smd circle (at -0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F4 smd circle (at -0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F5 smd circle (at 0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F6 smd circle (at 0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F7 smd circle (at 1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad F8 smd circle (at 1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G1 smd circle (at -1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G2 smd circle (at -1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G3 smd circle (at -0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G4 smd circle (at -0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G5 smd circle (at 0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G6 smd circle (at 0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G7 smd circle (at 1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad G8 smd circle (at 1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H1 smd circle (at -1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H2 smd circle (at -1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H3 smd circle (at -0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H4 smd circle (at -0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H5 smd circle (at 0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H6 smd circle (at 0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H7 smd circle (at 1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad H8 smd circle (at 1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.78 0.78) (thickness 0.117)))
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)
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(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-64_Die462.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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) |