61 lines
3.7 KiB
Plaintext
61 lines
3.7 KiB
Plaintext
(module Microchip_8E-16 (layer F.Cu) (tedit 5A0AA2C0)
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(descr "16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "QFN Microchip 8E 16")
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(solder_mask_margin 0.1)
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(attr smd)
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(fp_text reference REF** (at 0 -3.1) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value Microchip_8E-16 (at 0 3.1) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.8 0.8) (thickness 0.15)))
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)
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(fp_line (start -2 2) (end -2 -1) (layer F.Fab) (width 0.1))
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(fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.1))
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(fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.1))
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(fp_line (start -1 -2) (end 2 -2) (layer F.Fab) (width 0.1))
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(fp_line (start -2.5 -2.5) (end -2.5 2.5) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.5 -2.5) (end 2.5 -2.5) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.5 2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.175 -2.175) (end 2.175 -1.375) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.175 2.175) (end -2.175 1.375) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.175 2.175) (end 2.175 1.375) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.175 -2.175) (end -1.375 -2.175) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.175 2.175) (end -1.375 2.175) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.175 2.175) (end 1.375 2.175) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.175 -2.175) (end 1.375 -2.175) (layer F.SilkS) (width 0.15))
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(fp_line (start -1 -2) (end -2 -1) (layer F.Fab) (width 0.1))
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(pad 1 smd rect (at -1.8125 -0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -1.8125 -0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -1.8125 0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -1.8125 0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -0.975 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at -0.325 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 0.325 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 0.975 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 1.8125 0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at 1.8125 0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at 1.8125 -0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at 1.8125 -0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 0.975 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd rect (at 0.325 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd rect (at -0.325 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd rect (at -0.975 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 0.5375 0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 17 smd rect (at 0.5375 -0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 17 smd rect (at -0.5375 0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 17 smd rect (at -0.5375 -0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-16-1EP_4x4mm_Pitch0.65mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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