kicad-lib/kicad-footprints/Package_CSP.pretty/ST_WLCSP-66_Die411.kicad_mod

(module ST_WLCSP-66_Die411 (layer F.Cu) (tedit 5AE11EAD)
  (descr "WLCSP-66, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf")
  (tags "BGA 66 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -2.9855) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value ST_WLCSP-66_Die411 (at 0 2.9855) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.8195 1.9855) (end -1.8195 1.9855) (layer F.Fab) (width 0.1))
  (fp_line (start -1.8195 1.9855) (end -1.8195 -1.07575) (layer F.Fab) (width 0.1))
  (fp_line (start -1.8195 -1.07575) (end -0.90975 -1.9855) (layer F.Fab) (width 0.1))
  (fp_line (start -0.90975 -1.9855) (end 1.8195 -1.9855) (layer F.Fab) (width 0.1))
  (fp_line (start 1.8195 -1.9855) (end 1.8195 1.9855) (layer F.Fab) (width 0.1))
  (fp_line (start -2.82 -2.99) (end -2.82 2.99) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.82 2.99) (end 2.82 2.99) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.82 2.99) (end 2.82 -2.99) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.82 -2.99) (end -2.82 -2.99) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.03475 -2.1105) (end 1.9445 -2.1105) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.9445 -2.1105) (end 1.9445 2.1105) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.9445 2.1105) (end -1.9445 2.1105) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.9445 2.1105) (end -1.9445 -1.20075) (layer F.SilkS) (width 0.12))
  (pad A1 smd circle (at -1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A2 smd circle (at -1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A3 smd circle (at -0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A4 smd circle (at -0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A5 smd circle (at 0 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A6 smd circle (at 0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A7 smd circle (at 0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A8 smd circle (at 1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A9 smd circle (at 1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B1 smd circle (at -1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B2 smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B3 smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B4 smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B5 smd circle (at 0 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B6 smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B7 smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B8 smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B9 smd circle (at 1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C1 smd circle (at -1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C2 smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C3 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C7 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C8 smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C9 smd circle (at 1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D1 smd circle (at -1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D2 smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D3 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D7 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D8 smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D9 smd circle (at 1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E1 smd circle (at -1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E2 smd circle (at -1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E3 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E7 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E8 smd circle (at 1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E9 smd circle (at 1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F1 smd circle (at -1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F2 smd circle (at -1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F3 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F7 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F8 smd circle (at 1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F9 smd circle (at 1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G1 smd circle (at -1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G2 smd circle (at -1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G3 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G7 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G8 smd circle (at 1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G9 smd circle (at 1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H1 smd circle (at -1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H2 smd circle (at -1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H3 smd circle (at -0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H4 smd circle (at -0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H5 smd circle (at 0 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H6 smd circle (at 0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H7 smd circle (at 0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H8 smd circle (at 1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H9 smd circle (at 1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J1 smd circle (at -1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J2 smd circle (at -1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J3 smd circle (at -0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J4 smd circle (at -0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J5 smd circle (at 0 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J6 smd circle (at 0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J7 smd circle (at 0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J8 smd circle (at 1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J9 smd circle (at 1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.85 0.85) (thickness 0.1275)))
  )
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-66_Die411.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)