48 lines
2.8 KiB
Plaintext
48 lines
2.8 KiB
Plaintext
(module WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias (layer F.Cu) (tedit 5A65F2FF)
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(descr "WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf")
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(tags "WSON 0.5 thermal vias")
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(attr smd)
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(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias (at 0 2.55) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.075)))
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)
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(fp_line (start 0 -1.5) (end 1 -1.5) (layer F.Fab) (width 0.15))
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(fp_line (start 1 -1.5) (end 1 1.5) (layer F.Fab) (width 0.15))
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(fp_line (start 1 1.5) (end -1 1.5) (layer F.Fab) (width 0.15))
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(fp_line (start -1 1.5) (end -1 -0.5) (layer F.Fab) (width 0.15))
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(fp_line (start -1 -0.5) (end 0 -1.5) (layer F.Fab) (width 0.15))
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(fp_line (start -1.55 -1.8) (end -1.55 1.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.55 -1.8) (end 1.55 1.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start -1.55 -1.8) (end 1.55 -1.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start -1.55 1.8) (end 1.55 1.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start -0.575 1.625) (end 0.575 1.625) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.35 -1.625) (end 0.575 -1.625) (layer F.SilkS) (width 0.15))
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(pad 11 thru_hole circle (at 0 0.95) (size 0.5 0.5) (drill 0.2) (layers *.Cu F.Mask))
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(pad 11 thru_hole circle (at 0 -0.95) (size 0.5 0.5) (drill 0.2) (layers *.Cu F.Mask))
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(pad 11 thru_hole circle (at 0 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu F.Mask))
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(pad 11 smd rect (at 0 0) (size 0.84 2.4) (layers B.Cu))
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(pad 1 smd rect (at -0.95 -1) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -0.95 -0.5) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -0.95 0) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -0.95 0.5) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -0.95 1) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at 0.95 1) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 0.95 0.5) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 0.95 0) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 0.95 -0.5) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at 0.95 -1) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at 0 0) (size 0.84 2.4) (layers F.Cu F.Mask))
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(pad "" smd rect (at 0 -0.475) (size 0.65 0.7) (layers F.Paste))
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(pad "" smd rect (at 0 0.475) (size 0.65 0.7) (layers F.Paste))
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(model ${KISYS3DMOD}/Package_SON.3dshapes/WSON-10-1EP_2x3mm_Pitch0.5mm_EP0.84x2.4mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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