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kicad-lib/kicad-footprints/Package_CSP.pretty/ST_WLCSP-81_Die421.kicad_mod
willem b33866b8e3 added kicad footprints
2021-03-02 10:32:13 +01:00

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(module ST_WLCSP-81_Die421 (layer F.Cu) (tedit 5AE11EAD)
(descr "WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf")
(tags "BGA 81 0.4")
(attr smd)
(fp_text reference REF** (at 0 -2.9075) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ST_WLCSP-81_Die421 (at 0 2.9075) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.8465 1.9075) (end -1.8465 1.9075) (layer F.Fab) (width 0.1))
(fp_line (start -1.8465 1.9075) (end -1.8465 -0.98425) (layer F.Fab) (width 0.1))
(fp_line (start -1.8465 -0.98425) (end -0.92325 -1.9075) (layer F.Fab) (width 0.1))
(fp_line (start -0.92325 -1.9075) (end 1.8465 -1.9075) (layer F.Fab) (width 0.1))
(fp_line (start 1.8465 -1.9075) (end 1.8465 1.9075) (layer F.Fab) (width 0.1))
(fp_line (start -2.85 -2.91) (end -2.85 2.91) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.85 2.91) (end 2.85 2.91) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.85 2.91) (end 2.85 -2.91) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.85 -2.91) (end -2.85 -2.91) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.04825 -2.0325) (end 1.9715 -2.0325) (layer F.SilkS) (width 0.12))
(fp_line (start 1.9715 -2.0325) (end 1.9715 2.0325) (layer F.SilkS) (width 0.12))
(fp_line (start 1.9715 2.0325) (end -1.9715 2.0325) (layer F.SilkS) (width 0.12))
(fp_line (start -1.9715 2.0325) (end -1.9715 -1.10925) (layer F.SilkS) (width 0.12))
(pad A1 smd circle (at -1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A2 smd circle (at -1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A3 smd circle (at -0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A4 smd circle (at -0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A5 smd circle (at 0 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A6 smd circle (at 0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A7 smd circle (at 0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A8 smd circle (at 1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A9 smd circle (at 1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B1 smd circle (at -1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B2 smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B3 smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B4 smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B5 smd circle (at 0 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B6 smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B7 smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B8 smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B9 smd circle (at 1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C1 smd circle (at -1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C2 smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C3 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C4 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C5 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C6 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C7 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C8 smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C9 smd circle (at 1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D1 smd circle (at -1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D2 smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D3 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D4 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D5 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D6 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D7 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D8 smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D9 smd circle (at 1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E1 smd circle (at -1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E2 smd circle (at -1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E3 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E4 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E5 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E6 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E7 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E8 smd circle (at 1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E9 smd circle (at 1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F1 smd circle (at -1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F2 smd circle (at -1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F3 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F4 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F5 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F6 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F7 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F8 smd circle (at 1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F9 smd circle (at 1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G1 smd circle (at -1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G2 smd circle (at -1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G3 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G4 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G5 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G6 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G7 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G8 smd circle (at 1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G9 smd circle (at 1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H1 smd circle (at -1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H2 smd circle (at -1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H3 smd circle (at -0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H4 smd circle (at -0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H5 smd circle (at 0 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H6 smd circle (at 0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H7 smd circle (at 0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H8 smd circle (at 1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H9 smd circle (at 1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J1 smd circle (at -1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J2 smd circle (at -1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J3 smd circle (at -0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J4 smd circle (at -0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J5 smd circle (at 0 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J6 smd circle (at 0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J7 smd circle (at 0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J8 smd circle (at 1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J9 smd circle (at 1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.86 0.86) (thickness 0.129)))
)
(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-81_Die421.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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