160 lines
9.7 KiB
Plaintext
160 lines
9.7 KiB
Plaintext
(module ST_WLCSP-64_Die435 (layer F.Cu) (tedit 5AE11EAD)
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(descr "WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.35mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf")
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(tags "BGA 64 0.35")
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(attr smd)
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(fp_text reference REF** (at 0 -2.5635) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value ST_WLCSP-64_Die435 (at 0 2.5635) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 1.5705 1.5635) (end -1.5705 1.5635) (layer F.Fab) (width 0.1))
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(fp_line (start -1.5705 1.5635) (end -1.5705 -0.78175) (layer F.Fab) (width 0.1))
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(fp_line (start -1.5705 -0.78175) (end -0.78875 -1.5635) (layer F.Fab) (width 0.1))
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(fp_line (start -0.78875 -1.5635) (end 1.5705 -1.5635) (layer F.Fab) (width 0.1))
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(fp_line (start 1.5705 -1.5635) (end 1.5705 1.5635) (layer F.Fab) (width 0.1))
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(fp_line (start -2.58 -2.57) (end -2.58 2.57) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.58 2.57) (end 2.58 2.57) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.58 2.57) (end 2.58 -2.57) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.58 -2.57) (end -2.58 -2.57) (layer F.CrtYd) (width 0.05))
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(fp_line (start -0.91375 -1.6885) (end 1.6955 -1.6885) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.6955 -1.6885) (end 1.6955 1.6885) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.6955 1.6885) (end -1.6955 1.6885) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.6955 1.6885) (end -1.6955 -0.90675) (layer F.SilkS) (width 0.12))
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(pad A1 smd circle (at -1.225 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A2 smd circle (at -0.875 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A3 smd circle (at -0.525 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A4 smd circle (at -0.175 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A5 smd circle (at 0.175 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A6 smd circle (at 0.525 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A7 smd circle (at 0.875 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad A8 smd circle (at 1.225 -1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B1 smd circle (at -1.225 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B2 smd circle (at -0.875 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B3 smd circle (at -0.525 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B4 smd circle (at -0.175 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B5 smd circle (at 0.175 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B6 smd circle (at 0.525 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B7 smd circle (at 0.875 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad B8 smd circle (at 1.225 -0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C1 smd circle (at -1.225 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C2 smd circle (at -0.875 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C3 smd circle (at -0.525 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C4 smd circle (at -0.175 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C5 smd circle (at 0.175 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C6 smd circle (at 0.525 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C7 smd circle (at 0.875 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad C8 smd circle (at 1.225 -0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D1 smd circle (at -1.225 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D2 smd circle (at -0.875 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D3 smd circle (at -0.525 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D4 smd circle (at -0.175 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D5 smd circle (at 0.175 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D6 smd circle (at 0.525 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D7 smd circle (at 0.875 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad D8 smd circle (at 1.225 -0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E1 smd circle (at -1.225 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E2 smd circle (at -0.875 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E3 smd circle (at -0.525 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E4 smd circle (at -0.175 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E5 smd circle (at 0.175 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E6 smd circle (at 0.525 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E7 smd circle (at 0.875 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad E8 smd circle (at 1.225 0.175) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F1 smd circle (at -1.225 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F2 smd circle (at -0.875 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F3 smd circle (at -0.525 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F4 smd circle (at -0.175 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F5 smd circle (at 0.175 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F6 smd circle (at 0.525 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F7 smd circle (at 0.875 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad F8 smd circle (at 1.225 0.525) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G1 smd circle (at -1.225 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G2 smd circle (at -0.875 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G3 smd circle (at -0.525 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G4 smd circle (at -0.175 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G5 smd circle (at 0.175 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G6 smd circle (at 0.525 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G7 smd circle (at 0.875 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad G8 smd circle (at 1.225 0.875) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H1 smd circle (at -1.225 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H2 smd circle (at -0.875 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H3 smd circle (at -0.525 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H4 smd circle (at -0.175 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H5 smd circle (at 0.175 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H6 smd circle (at 0.525 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H7 smd circle (at 0.875 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(pad H8 smd circle (at 1.225 1.225) (size 0.21 0.21) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.059524))
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.73 0.73) (thickness 0.1095)))
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)
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(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-64_Die435.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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) |