78 lines
6.1 KiB
Plaintext
78 lines
6.1 KiB
Plaintext
(footprint "WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 5B391AD1)
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(descr "WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf")
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(tags "BGA 20 0.4")
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(attr smd)
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(fp_text reference "REF**" (at 0 -2.217) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp eb53fb0b-e9ad-407a-a4ec-24bc71f4f71e)
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)
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(fp_text value "WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm" (at 0 2.217) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 3d1622d0-8be8-4795-b989-79d23959202a)
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)
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(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
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(effects (font (size 0.45 0.45) (thickness 0.0675)))
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(tstamp fd953f13-f39c-4812-871f-2fb3f8e11967)
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)
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(fp_line (start 1.092 -1.342) (end 1.092 1.342) (layer "F.SilkS") (width 0.12) (tstamp 18f58b2b-6ecd-4b5e-b1d6-62e46ffecff6))
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(fp_line (start 1.092 1.342) (end -1.092 1.342) (layer "F.SilkS") (width 0.12) (tstamp a6771ba0-cfbf-4522-afe4-7ce8ce56d754))
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(fp_line (start 1.97 2.22) (end 1.97 -2.22) (layer "F.CrtYd") (width 0.05) (tstamp 670cf86f-c94e-42ac-a477-3e4f41529e4a))
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(fp_line (start -1.97 -2.22) (end -1.97 2.22) (layer "F.CrtYd") (width 0.05) (tstamp a60b6bc9-64f1-455d-b30f-109c5c7908ac))
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(fp_line (start -1.97 2.22) (end 1.97 2.22) (layer "F.CrtYd") (width 0.05) (tstamp b79581a3-3ba3-499f-af92-7b6437f15fba))
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(fp_line (start 0.967 1.217) (end -0.967 1.217) (layer "F.Fab") (width 0.1) (tstamp e9fe455d-ab59-412a-a1d5-d07820608298))
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(pad "A1" smd circle (at -0.6 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp ad02dab1-a030-4431-969e-716e65d018c1))
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(pad "A2" smd circle (at -0.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "A3" smd circle (at 0.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "A4" smd circle (at 0.6 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp c4dedbf0-90cb-4ddb-955b-00aed95b98dd))
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(pad "B1" smd circle (at -0.6 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp add710fd-410f-453b-b915-6043e8549c03))
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(pad "B2" smd circle (at -0.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp ba9daf12-45f2-48f7-9f55-4afa3393662a))
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(pad "B3" smd circle (at 0.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp b6df9bd0-ed42-4306-8047-72250350c324))
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(pad "B4" smd circle (at 0.6 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 9285c021-c431-4478-a0c6-4e78f3c87210))
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(pad "C1" smd circle (at -0.6 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 3a309737-6554-4d31-92cc-f85651b18efb))
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(pad "C2" smd circle (at -0.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 42ec30f3-4b59-4e18-8d38-67c1f6745162))
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(pad "C3" smd circle (at 0.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp f4143b97-c6ee-4f1b-b7fd-f091f30ebf84))
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(pad "C4" smd circle (at 0.6 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 50ca0693-cbb5-49fb-aa15-0c6967922d63))
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(pad "D1" smd circle (at -0.6 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 2f4b4a4c-2dc8-4ef8-9bb6-1b60d25f1eab))
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(pad "D2" smd circle (at -0.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp a11d305d-b480-4182-b065-c43e437fd8bd))
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(pad "D3" smd circle (at 0.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp fcbc5354-42fa-47f2-b915-d97abe322d96))
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(pad "D4" smd circle (at 0.6 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 2163cd4d-8a8d-4ff0-9783-9316db3f2da3))
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(pad "E1" smd circle (at -0.6 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp ff2f8b60-6d01-4615-8708-28f7938c065e))
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(pad "E2" smd circle (at -0.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp 91ba4bff-7a62-442a-9f41-97c340d5824a))
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(pad "E3" smd circle (at 0.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E4" smd circle (at 0.6 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin_ratio 0.055556) (tstamp a2183e1e-b40e-4aaa-8912-836e36093ee6))
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(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm.wrl"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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