libs/kicad-lib
1
0
Fork 0
Code Issues Pull Requests Packages Projects Releases Wiki Activity
Files
cbbf8a1967924432b0f63721a5a1f9b206163103
kicad-lib/kicad-footprints/Package_CSP.pretty/ST_WLCSP-49_Die435.kicad_mod
willem fd6b549f71 updated to v6 libs
2022-02-02 13:54:01 +01:00

136 lines
11 KiB
Plaintext
Raw Blame History

(footprint "ST_WLCSP-49_Die435" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf")
(tags "BGA 49 0.4")
(attr smd)
(fp_text reference "REF**" (at 0 -2.5635) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp cb5d4b50-e989-48b6-ba5a-a4e1fa43e28b)
)
(fp_text value "ST_WLCSP-49_Die435" (at 0 2.5635) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 68ac1740-979f-4ad0-ad53-7d29be44a181)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.73 0.73) (thickness 0.1095)))
(tstamp fb51caa3-1af9-40ef-afab-1ebfd756d56c)
)
(fp_line (start 1.6955 1.6885) (end -1.6955 1.6885) (layer "F.SilkS") (width 0.12) (tstamp 2694e1fa-65dc-4375-a9af-fbfa73b736d4))
(fp_line (start -0.91375 -1.6885) (end 1.6955 -1.6885) (layer "F.SilkS") (width 0.12) (tstamp 5cade037-b888-4a51-a0fc-163ea38fefc3))
(fp_line (start 1.6955 -1.6885) (end 1.6955 1.6885) (layer "F.SilkS") (width 0.12) (tstamp 7149f835-6e39-4d39-95bc-747c0855fed3))
(fp_line (start -1.6955 1.6885) (end -1.6955 -0.90675) (layer "F.SilkS") (width 0.12) (tstamp 8135b0c7-bb2d-4194-a37f-52ede7d54a09))
(fp_line (start 2.58 2.57) (end 2.58 -2.57) (layer "F.CrtYd") (width 0.05) (tstamp 1317a4ff-b885-4ae9-8a63-ce53872655f9))
(fp_line (start -2.58 -2.57) (end -2.58 2.57) (layer "F.CrtYd") (width 0.05) (tstamp 33f2ff9a-a4e1-4aa6-b79b-114215bdd845))
(fp_line (start 2.58 -2.57) (end -2.58 -2.57) (layer "F.CrtYd") (width 0.05) (tstamp bb68c158-fd51-4dc5-9d93-33bcfdd9e102))
(fp_line (start -2.58 2.57) (end 2.58 2.57) (layer "F.CrtYd") (width 0.05) (tstamp bda4f170-d1dc-4c12-b0fb-a1550590f9de))
(fp_line (start 1.5705 1.5635) (end -1.5705 1.5635) (layer "F.Fab") (width 0.1) (tstamp 0728ea56-8e5c-434f-9388-dd1dfc03c370))
(fp_line (start -0.78875 -1.5635) (end 1.5705 -1.5635) (layer "F.Fab") (width 0.1) (tstamp 4083f115-4980-49e2-b8f1-0c2f3aa66a28))
(fp_line (start -1.5705 1.5635) (end -1.5705 -0.78175) (layer "F.Fab") (width 0.1) (tstamp 82015bea-ab1f-4a27-ade1-01becba40b74))
(fp_line (start 1.5705 -1.5635) (end 1.5705 1.5635) (layer "F.Fab") (width 0.1) (tstamp b04f03fe-79bc-4bc1-b9b7-5386e551dc3d))
(fp_line (start -1.5705 -0.78175) (end -0.78875 -1.5635) (layer "F.Fab") (width 0.1) (tstamp edfd2b93-fcec-44dc-868f-2b3eccf99e9d))
(pad "A1" smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1109bb58-65a6-492b-8d25-6f66a127fa2b))
(pad "A2" smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 68e7ec25-9f85-4d9e-affe-907362dc1da1))
(pad "A3" smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 46bfac5c-cb33-477b-972e-9ed892974ea8))
(pad "A4" smd circle (at 0 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 68c07721-3551-4311-b341-f666c82d1911))
(pad "A5" smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4c12ccdb-2fb6-43d4-8e49-cb3dbf255085))
(pad "A6" smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 454b8d12-78ba-4ac5-907f-004900a9b4a6))
(pad "A7" smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ce668521-be87-49f2-86f5-2ee5919cefb1))
(pad "B1" smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 2f35d9cc-6b23-44c7-ad7c-f2530801554a))
(pad "B2" smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a7805712-055e-44e4-8f30-0ea9e42f4c5f))
(pad "B3" smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c12c2876-e019-40fd-b3d6-644c7c8d5ea3))
(pad "B4" smd circle (at 0 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 89a04ad8-1c5c-4e73-b092-69fa651acf9e))
(pad "B5" smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1fbe61e2-7bb7-4d23-b2ed-2d6563d11a19))
(pad "B6" smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp d792efca-463d-419f-9e68-2c3bcd943881))
(pad "B7" smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp cfc27177-5108-475b-9aad-f964b9c89c91))
(pad "C1" smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 627feaf1-dacc-49fe-aace-cece411ffc61))
(pad "C2" smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp f9c40d20-bf01-4776-8f36-ae9eb0fcb842))
(pad "C3" smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0084366e-955b-4c56-b18a-0a5ef38d4e0d))
(pad "C4" smd circle (at 0 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 76135b49-d566-4d37-8110-e2b63906c3cc))
(pad "C5" smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4b1d3790-d53d-4dd9-85fc-ff2fdb31e9c1))
(pad "C6" smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 7658cd9d-55c3-4539-9f8b-85c856860018))
(pad "C7" smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c9fae2b7-02a3-4f75-9791-0f4599aa7f40))
(pad "D1" smd circle (at -1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 3346c479-5443-4cbd-a5ee-5ecab92d1028))
(pad "D2" smd circle (at -0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 20ec2215-6b84-4aa8-a383-40141e75df40))
(pad "D3" smd circle (at -0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 5a435272-6f2f-4ae4-a87b-f3a76ea5850c))
(pad "D4" smd circle (at 0 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 3f702e9b-4338-40c7-be97-e6144965303e))
(pad "D5" smd circle (at 0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4c1c689f-b225-42a8-aef9-859ccc558e99))
(pad "D6" smd circle (at 0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9335e854-f75b-4fb4-b7c2-712fe84982c0))
(pad "D7" smd circle (at 1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a0f84542-9eba-46eb-a08b-a54310d81278))
(pad "E1" smd circle (at -1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 429ce7c8-1704-4fc1-98c5-d1f0efe63847))
(pad "E2" smd circle (at -0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ecd08d9e-e876-407e-a810-22faa7774281))
(pad "E3" smd circle (at -0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 37f5ea67-0817-40e9-a7c0-79da563e6a71))
(pad "E4" smd circle (at 0 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 38f8bf29-a9b7-4931-b83d-2a9fbcdfd9bb))
(pad "E5" smd circle (at 0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 37f35a19-7562-41cd-a572-9aa0f866d475))
(pad "E6" smd circle (at 0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 30276dd6-3591-4c6e-978c-fe69f3926f07))
(pad "E7" smd circle (at 1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4a0fd158-00cc-4712-a217-a7c0d7150924))
(pad "F1" smd circle (at -1.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp f1c94102-e4fa-420d-a524-b84b02766c2d))
(pad "F2" smd circle (at -0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9595dab0-beb9-425e-a9af-96a6b510e49d))
(pad "F3" smd circle (at -0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 24ab0abf-e970-4c84-895e-677a005be764))
(pad "F4" smd circle (at 0 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b01d9fb0-08ff-47d1-8120-4e5dfd417656))
(pad "F5" smd circle (at 0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 67d99a6c-c91b-421f-a02a-536b9d3b4409))
(pad "F6" smd circle (at 0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 44d80d15-b127-4cb7-891a-befc40300997))
(pad "F7" smd circle (at 1.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 92895e5a-0abc-4ebc-afa2-04053645e6bc))
(pad "G1" smd circle (at -1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a1870854-99e1-4253-9dc7-7454e8e3cab8))
(pad "G2" smd circle (at -0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 45261aef-8454-4a86-ab54-700197096ad3))
(pad "G3" smd circle (at -0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1c66faf2-7e64-47cd-95e2-1043ceee0717))
(pad "G4" smd circle (at 0 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 33909300-8b02-4d3e-80fa-dfd1406d4ef5))
(pad "G5" smd circle (at 0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6fbe3e43-0bf1-4f3d-b3cd-3f3f339f46a0))
(pad "G6" smd circle (at 0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 61069ff6-64f8-435b-8030-990f0a369256))
(pad "G7" smd circle (at 1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4dac0885-c9d2-4b61-8f09-e8a9c90397fc))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-49_Die435.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
Reference in New Issue View Git Blame Copy Permalink