60 lines
5.4 KiB
Plaintext
60 lines
5.4 KiB
Plaintext
(footprint "TI_SO-PowerPAD-8_ThermalVias" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 5A02F2D3)
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(descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf")
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(tags "HTSOP 1.27")
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(attr smd)
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(fp_text reference "REF**" (at 0 -3.5) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 377378f0-7c1a-45aa-b353-dc4f0f32abc9)
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)
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(fp_text value "TI_SO-PowerPAD-8_ThermalVias" (at 0 3.5) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp c924561c-5e62-4154-93ed-2bd7fadf520c)
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)
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(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
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(effects (font (size 0.9 0.9) (thickness 0.135)))
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(tstamp 6f273f6e-cde2-4a2f-8e34-6785dcb3b799)
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)
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(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer "F.SilkS") (width 0.15) (tstamp 1b0b03b4-9c28-4dcc-a66a-26c8beaf94ea))
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(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer "F.SilkS") (width 0.15) (tstamp 418a55b6-343c-4393-821c-6fa540f925a2))
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(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer "F.SilkS") (width 0.15) (tstamp 72dca877-7894-472c-b8a4-6ecc06a79366))
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(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer "F.SilkS") (width 0.15) (tstamp 76cf6181-e8c6-4ee4-9cb7-592a7be7f775))
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(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer "F.SilkS") (width 0.15) (tstamp 8098185d-c209-447f-a2ec-cb1a27750da5))
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(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer "F.SilkS") (width 0.15) (tstamp d1dd97c4-b465-4d79-b016-06fbfe48556c))
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(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer "F.SilkS") (width 0.15) (tstamp fbe98391-6257-465c-8cf0-163e9a2cbd38))
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(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer "F.CrtYd") (width 0.05) (tstamp 9b777e7c-82c3-44de-9a79-ee5ad32ed994))
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(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer "F.CrtYd") (width 0.05) (tstamp a907de46-7bb2-45f6-a857-1e96d8a77b80))
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(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer "F.CrtYd") (width 0.05) (tstamp b93ff26e-5a04-49d1-9d3c-07bcc3b36d5f))
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(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer "F.CrtYd") (width 0.05) (tstamp ddd274a6-68ec-439c-820b-e63204b9ca76))
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(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer "F.Fab") (width 0.15) (tstamp 6b6f2aa3-3315-4fbb-a100-fb7c24b3fad0))
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(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer "F.Fab") (width 0.15) (tstamp 6d203727-61a5-411c-9e1d-c4641d2fe0d5))
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(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer "F.Fab") (width 0.15) (tstamp 7aed3ff4-8438-4356-beb5-bb1097c0bb85))
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(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer "F.Fab") (width 0.15) (tstamp e87f0675-d735-4a91-8bae-2ac23c449342))
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(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer "F.Fab") (width 0.15) (tstamp fe348068-0d1d-4b01-bf75-e17b1dc4a98d))
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(pad "1" smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6b9e77e3-d0be-495e-bb8f-bff438be5fc4))
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(pad "2" smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 98d44a67-a61c-4648-99d4-6b78f69f33fa))
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(pad "3" smd rect (at -2.7 0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f981daf7-5970-4bcc-99f3-4ff5a5b0a28e))
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(pad "4" smd rect (at -2.7 1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2661e05-fb09-4514-92db-84753b88482e))
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(pad "5" smd rect (at 2.7 1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4527ef1e-d3d6-435c-b0ad-479738e4ae9d))
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(pad "6" smd rect (at 2.7 0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8c987c0f-d9ce-44e9-94eb-42bdbb4d6472))
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(pad "7" smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b73a66b1-d41f-4e93-903e-d84d9c1e160f))
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(pad "8" smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4e54a4cf-f18a-406b-b35d-fff0c8cec0bb))
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(pad "9" thru_hole circle (at 0.6 -1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 58ed4089-9be8-4bc7-a0e6-94e36b6cb6a4))
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(pad "9" thru_hole circle (at -0.6 -0.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 631e7685-f5a9-45a8-9094-05177d9ea36f))
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(pad "9" thru_hole circle (at -0.6 0.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 72a6d508-82c0-4751-87d6-e206b945accf))
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(pad "9" thru_hole circle (at -0.6 -1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 7a0b1d27-eb0c-4232-8171-82c60f809b4d))
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(pad "9" thru_hole circle (at -0.6 1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 8833adba-9a3a-43e4-9561-15e3f36a8ddc))
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(pad "9" thru_hole circle (at 0.6 -0.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 8de84454-d564-4348-9100-7a90909733f1))
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(pad "9" thru_hole circle (at 0.6 0.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp a3ef04df-908a-468c-b6be-69f62f86074d))
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(pad "9" thru_hole circle (at 0.6 1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp a74d6881-6429-44e6-a656-c91719f2ace6))
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(pad "9" smd rect (at 0 0) (size 2.95 4.5) (layers "F.Cu") (tstamp b23d09de-c5bd-4860-b894-2a99a595f2ad))
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(pad "9" smd rect (at 0 0) (size 2.95 4.5) (layers "B.Cu") (tstamp da8e3227-a937-4eba-af67-c7250c697189))
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(pad "9" smd rect (at 0 0) (size 2.6 3.1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp dafcdc19-3ca3-44cd-a0f1-b0affbcdb922))
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(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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