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kicad-lib/kicad-footprints/Package_CSP.pretty/ST_WLCSP-81_Die421.kicad_mod
willem fd6b549f71 updated to v6 libs
2022-02-02 13:54:01 +01:00

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(footprint "ST_WLCSP-81_Die421" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf")
(tags "BGA 81 0.4")
(attr smd)
(fp_text reference "REF**" (at 0 -2.9075) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 63bd7ed2-f6d8-4e2d-8c37-8ec793ae5122)
)
(fp_text value "ST_WLCSP-81_Die421" (at 0 2.9075) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp c11540c1-3d17-4ae1-83c1-c39f0b4b9fb7)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.86 0.86) (thickness 0.129)))
(tstamp b156d973-6e47-4e4b-90fb-921408435c17)
)
(fp_line (start -1.04825 -2.0325) (end 1.9715 -2.0325) (layer "F.SilkS") (width 0.12) (tstamp 0a7bcf48-41e8-4d91-9f42-05e0b140b93d))
(fp_line (start 1.9715 2.0325) (end -1.9715 2.0325) (layer "F.SilkS") (width 0.12) (tstamp 96793746-c109-4f88-b48f-4ad182325f79))
(fp_line (start -1.9715 2.0325) (end -1.9715 -1.10925) (layer "F.SilkS") (width 0.12) (tstamp a800d664-e287-4de2-b7d3-7dae248e5c6c))
(fp_line (start 1.9715 -2.0325) (end 1.9715 2.0325) (layer "F.SilkS") (width 0.12) (tstamp ad2395a5-c0e2-45d1-bedc-3e2f72b09b20))
(fp_line (start 2.85 -2.91) (end -2.85 -2.91) (layer "F.CrtYd") (width 0.05) (tstamp 7166ef40-b65d-4c73-bc75-1de30fee2241))
(fp_line (start -2.85 -2.91) (end -2.85 2.91) (layer "F.CrtYd") (width 0.05) (tstamp 78b32f64-1eda-47b8-91a5-026a314b0bf9))
(fp_line (start -2.85 2.91) (end 2.85 2.91) (layer "F.CrtYd") (width 0.05) (tstamp ab5c6940-db39-4433-9c19-b3f402440c1f))
(fp_line (start 2.85 2.91) (end 2.85 -2.91) (layer "F.CrtYd") (width 0.05) (tstamp e63d0c72-f88d-42d5-b3d9-67512a5cd3b2))
(fp_line (start -1.8465 1.9075) (end -1.8465 -0.98425) (layer "F.Fab") (width 0.1) (tstamp 0bc9ae91-82e4-4188-881d-c90015d287bf))
(fp_line (start 1.8465 1.9075) (end -1.8465 1.9075) (layer "F.Fab") (width 0.1) (tstamp 1e3348a7-0702-475b-bfb4-6c6b35f1a90b))
(fp_line (start -1.8465 -0.98425) (end -0.92325 -1.9075) (layer "F.Fab") (width 0.1) (tstamp 23294315-eee6-4904-beb1-80e421e57204))
(fp_line (start 1.8465 -1.9075) (end 1.8465 1.9075) (layer "F.Fab") (width 0.1) (tstamp 64459b0e-2812-4b01-ac85-9474597fdcf2))
(fp_line (start -0.92325 -1.9075) (end 1.8465 -1.9075) (layer "F.Fab") (width 0.1) (tstamp a4af9a93-63ec-4e44-a0c9-756e4b164ee8))
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(pad "H8" smd circle (at 1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 95a2f63c-9ef1-479f-8957-5ddf239e9443))
(pad "H9" smd circle (at 1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9f19df47-f0f1-406e-8f7e-f9fca2878a52))
(pad "J1" smd circle (at -1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 219fa8ef-2f45-4360-94a0-aa20a20d5133))
(pad "J2" smd circle (at -1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c0a3bccd-c4aa-46de-83a0-e080fe16c185))
(pad "J3" smd circle (at -0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1c404afe-932b-4e29-b837-38fb925e0089))
(pad "J4" smd circle (at -0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 17f87316-ed17-4043-8080-9a91716d83e5))
(pad "J5" smd circle (at 0 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp eae64d45-c74c-4471-b0c9-d0d98477e0aa))
(pad "J6" smd circle (at 0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 48aaa59d-8564-4098-bb88-f440d4c401d5))
(pad "J7" smd circle (at 0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 08071055-c56b-47eb-b5d7-c1fd49b1451c))
(pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b5e5b721-ddaf-468b-92f5-1ed9b948c736))
(pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 96807702-0008-44db-af94-d3497c978d10))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-81_Die421.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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