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kicad-lib/kicad-footprints/Package_CSP.pretty/ST_WLCSP-180_Die451.kicad_mod
willem b33866b8e3 added kicad footprints
2021-03-02 10:32:13 +01:00

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(module ST_WLCSP-180_Die451 (layer F.Cu) (tedit 5AE11EAD)
(descr "WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf")
(tags "BGA 180 0.4")
(attr smd)
(fp_text reference REF** (at 0 -4.0475) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ST_WLCSP-180_Die451 (at 0 4.0475) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 2.7685 3.0475) (end -2.7685 3.0475) (layer F.Fab) (width 0.1))
(fp_line (start -2.7685 3.0475) (end -2.7685 -2.0475) (layer F.Fab) (width 0.1))
(fp_line (start -2.7685 -2.0475) (end -1.7685 -3.0475) (layer F.Fab) (width 0.1))
(fp_line (start -1.7685 -3.0475) (end 2.7685 -3.0475) (layer F.Fab) (width 0.1))
(fp_line (start 2.7685 -3.0475) (end 2.7685 3.0475) (layer F.Fab) (width 0.1))
(fp_line (start -3.77 -4.05) (end -3.77 4.05) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.77 4.05) (end 3.77 4.05) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.77 4.05) (end 3.77 -4.05) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.77 -4.05) (end -3.77 -4.05) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.8935 -3.1725) (end 2.8935 -3.1725) (layer F.SilkS) (width 0.12))
(fp_line (start 2.8935 -3.1725) (end 2.8935 3.1725) (layer F.SilkS) (width 0.12))
(fp_line (start 2.8935 3.1725) (end -2.8935 3.1725) (layer F.SilkS) (width 0.12))
(fp_line (start -2.8935 3.1725) (end -2.8935 -2.1725) (layer F.SilkS) (width 0.12))
(pad A1 smd circle (at -2.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A2 smd circle (at -2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A3 smd circle (at -1.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A4 smd circle (at -1.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A5 smd circle (at -0.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A6 smd circle (at -0.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A7 smd circle (at 0 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A8 smd circle (at 0.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A9 smd circle (at 0.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A10 smd circle (at 1.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A11 smd circle (at 1.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A12 smd circle (at 2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A13 smd circle (at 2.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B1 smd circle (at -2.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B2 smd circle (at -2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B3 smd circle (at -1.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B4 smd circle (at -1.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B5 smd circle (at -0.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B6 smd circle (at -0.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B7 smd circle (at 0 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B8 smd circle (at 0.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B9 smd circle (at 0.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B10 smd circle (at 1.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B11 smd circle (at 1.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B12 smd circle (at 2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B13 smd circle (at 2.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C1 smd circle (at -2.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C2 smd circle (at -2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C3 smd circle (at -1.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C4 smd circle (at -1.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C5 smd circle (at -0.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C6 smd circle (at -0.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C7 smd circle (at 0 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C8 smd circle (at 0.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C9 smd circle (at 0.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C10 smd circle (at 1.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C11 smd circle (at 1.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C12 smd circle (at 2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C13 smd circle (at 2.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D1 smd circle (at -2.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D2 smd circle (at -2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D3 smd circle (at -1.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D4 smd circle (at -1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D5 smd circle (at -0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D6 smd circle (at -0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D7 smd circle (at 0 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D8 smd circle (at 0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D9 smd circle (at 0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D10 smd circle (at 1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D11 smd circle (at 1.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D12 smd circle (at 2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D13 smd circle (at 2.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E1 smd circle (at -2.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E2 smd circle (at -2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E3 smd circle (at -1.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E4 smd circle (at -1.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E5 smd circle (at -0.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E6 smd circle (at -0.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E7 smd circle (at 0 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E8 smd circle (at 0.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E9 smd circle (at 0.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E10 smd circle (at 1.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E11 smd circle (at 1.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E12 smd circle (at 2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E13 smd circle (at 2.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F1 smd circle (at -2.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F2 smd circle (at -2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F3 smd circle (at -1.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F4 smd circle (at -1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F5 smd circle (at -0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F6 smd circle (at -0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F7 smd circle (at 0 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F8 smd circle (at 0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F9 smd circle (at 0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F10 smd circle (at 1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F11 smd circle (at 1.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F12 smd circle (at 2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad F13 smd circle (at 2.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G1 smd circle (at -2.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G2 smd circle (at -2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G3 smd circle (at -1.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G4 smd circle (at -1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G5 smd circle (at -0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G6 smd circle (at -0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G8 smd circle (at 0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G9 smd circle (at 0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G10 smd circle (at 1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G11 smd circle (at 1.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G12 smd circle (at 2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad G13 smd circle (at 2.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H1 smd circle (at -2.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H2 smd circle (at -2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H3 smd circle (at -1.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H4 smd circle (at -1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H5 smd circle (at -0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H6 smd circle (at -0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H8 smd circle (at 0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H9 smd circle (at 0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H10 smd circle (at 1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H11 smd circle (at 1.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H12 smd circle (at 2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad H13 smd circle (at 2.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J1 smd circle (at -2.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J2 smd circle (at -2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J3 smd circle (at -1.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J4 smd circle (at -1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J5 smd circle (at -0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J6 smd circle (at -0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J7 smd circle (at 0 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J8 smd circle (at 0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J9 smd circle (at 0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J10 smd circle (at 1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J11 smd circle (at 1.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J12 smd circle (at 2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad J13 smd circle (at 2.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K1 smd circle (at -2.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K2 smd circle (at -2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K3 smd circle (at -1.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K4 smd circle (at -1.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K5 smd circle (at -0.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K6 smd circle (at -0.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K7 smd circle (at 0 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K8 smd circle (at 0.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K9 smd circle (at 0.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K10 smd circle (at 1.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K11 smd circle (at 1.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K12 smd circle (at 2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad K13 smd circle (at 2.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L1 smd circle (at -2.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L2 smd circle (at -2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L3 smd circle (at -1.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L4 smd circle (at -1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L5 smd circle (at -0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L6 smd circle (at -0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L7 smd circle (at 0 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L8 smd circle (at 0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L9 smd circle (at 0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L10 smd circle (at 1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L11 smd circle (at 1.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L12 smd circle (at 2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad L13 smd circle (at 2.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M1 smd circle (at -2.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M2 smd circle (at -2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M3 smd circle (at -1.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M4 smd circle (at -1.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M5 smd circle (at -0.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M6 smd circle (at -0.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M7 smd circle (at 0 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M8 smd circle (at 0.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M9 smd circle (at 0.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M10 smd circle (at 1.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M11 smd circle (at 1.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M12 smd circle (at 2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad M13 smd circle (at 2.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N1 smd circle (at -2.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N2 smd circle (at -2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N3 smd circle (at -1.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N4 smd circle (at -1.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N5 smd circle (at -0.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N6 smd circle (at -0.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N7 smd circle (at 0 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N8 smd circle (at 0.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N9 smd circle (at 0.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N10 smd circle (at 1.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N11 smd circle (at 1.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N12 smd circle (at 2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad N13 smd circle (at 2.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P1 smd circle (at -2.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P2 smd circle (at -2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P3 smd circle (at -1.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P4 smd circle (at -1.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P5 smd circle (at -0.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P6 smd circle (at -0.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P7 smd circle (at 0 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P8 smd circle (at 0.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P9 smd circle (at 0.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P10 smd circle (at 1.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P11 smd circle (at 1.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P12 smd circle (at 2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad P13 smd circle (at 2.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-180_Die451.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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