82 lines
4.8 KiB
Plaintext
82 lines
4.8 KiB
Plaintext
(module ST_WLCSP-25_Die444 (layer F.Cu) (tedit 5AE11EAD)
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(descr "WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf")
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(tags "BGA 25 0.4")
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(attr smd)
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(fp_text reference REF** (at 0 -2.1625) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value ST_WLCSP-25_Die444 (at 0 2.1625) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 1.2115 1.1625) (end -1.2115 1.1625) (layer F.Fab) (width 0.1))
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(fp_line (start -1.2115 1.1625) (end -1.2115 -0.58125) (layer F.Fab) (width 0.1))
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(fp_line (start -1.2115 -0.58125) (end -0.63025 -1.1625) (layer F.Fab) (width 0.1))
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(fp_line (start -0.63025 -1.1625) (end 1.2115 -1.1625) (layer F.Fab) (width 0.1))
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(fp_line (start 1.2115 -1.1625) (end 1.2115 1.1625) (layer F.Fab) (width 0.1))
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(fp_line (start -2.22 -2.17) (end -2.22 2.17) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.22 2.17) (end 2.22 2.17) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.22 2.17) (end 2.22 -2.17) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.22 -2.17) (end -2.22 -2.17) (layer F.CrtYd) (width 0.05))
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(fp_line (start -0.75525 -1.2875) (end 1.3365 -1.2875) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.3365 -1.2875) (end 1.3365 1.2875) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.3365 1.2875) (end -1.3365 1.2875) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.3365 1.2875) (end -1.3365 -0.70625) (layer F.SilkS) (width 0.12))
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(pad A1 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A2 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A3 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A4 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad A5 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B1 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B2 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B3 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B4 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad B5 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C1 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C2 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C3 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C4 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad C5 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D1 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D2 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D3 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D4 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad D5 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E1 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E2 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E3 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E4 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(pad E5 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
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(solder_paste_margin_ratio 0.055556))
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.56 0.56) (thickness 0.084)))
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)
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(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-25_Die444.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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) |