(footprint "Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0AA1EB)
  (descr "Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)")
  (tags "Texas Instruments DSBGA BGA YZP R-XBGA-N8")
  (solder_mask_margin 0.05)
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1d18fa8b-7d8d-4097-a186-366346c1ad37)
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    (tstamp b86e7d6c-7199-4865-b387-670b4a9bd0bc)
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  (pad "A1" smd circle (at -0.25 -0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp dc266066-3d8b-43dc-a642-ed3e3de451ab))
  (pad "A2" smd circle (at 0.25 -0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp bd2d2994-d0e5-4d81-b307-063419580d14))
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  (pad "B2" smd circle (at 0.25 -0.25) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 71ac2677-d3c6-4758-9ddc-ffef65567491))
  (pad "C1" smd circle (at -0.25 0.25) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 14060147-9e3a-4fb2-84a4-3da62013e7e3))
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  (pad "D1" smd circle (at -0.25 0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp fad3df75-6d3d-454d-bd16-4a9c7f807263))
  (pad "D2" smd circle (at 0.25 0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp fcc4d09c-64ff-49b5-a6dc-81869bc7aaf3))
  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)