(footprint "Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0AA1EB)
  (descr "Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)")
  (tags "Texas Instruments DSBGA BGA YZR0009")
  (solder_mask_margin 0.05)
  (attr smd)
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    (tstamp 503624d4-92f8-49b5-af5d-8103111de69b)
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    (tstamp 509af688-68f1-4f81-baec-296c8d23f2af)
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    (tstamp bb7f7954-7926-462e-b67c-d16e93b27746)
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  (pad "B2" smd circle (at 0 0) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 390ffb54-e48f-43be-9822-3da2a8410ab8))
  (pad "B3" smd circle (at 0.5 0) (size 0.165 0.165) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp adc427c3-2b94-4973-9be3-bac903c1e3e0))
  (pad "C1" smd circle (at -0.5 0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 0cff1b29-a904-4bc6-a387-2ae3baf69a5d))
  (pad "C2" smd circle (at 0 0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 4a7ad7f6-06e7-43ac-b373-e2deedae3973))
  (pad "C3" smd circle (at 0.5 0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 80265cad-4a9d-4cc8-9b6c-fdca371add69))
  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)