(module ST_WLCSP-180_Die451 (layer F.Cu) (tedit 5AE11EAD)
  (descr "WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf")
  (tags "BGA 180 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -4.0475) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value ST_WLCSP-180_Die451 (at 0 4.0475) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 2.7685 3.0475) (end -2.7685 3.0475) (layer F.Fab) (width 0.1))
  (fp_line (start -2.7685 3.0475) (end -2.7685 -2.0475) (layer F.Fab) (width 0.1))
  (fp_line (start -2.7685 -2.0475) (end -1.7685 -3.0475) (layer F.Fab) (width 0.1))
  (fp_line (start -1.7685 -3.0475) (end 2.7685 -3.0475) (layer F.Fab) (width 0.1))
  (fp_line (start 2.7685 -3.0475) (end 2.7685 3.0475) (layer F.Fab) (width 0.1))
  (fp_line (start -3.77 -4.05) (end -3.77 4.05) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.77 4.05) (end 3.77 4.05) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.77 4.05) (end 3.77 -4.05) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.77 -4.05) (end -3.77 -4.05) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.8935 -3.1725) (end 2.8935 -3.1725) (layer F.SilkS) (width 0.12))
  (fp_line (start 2.8935 -3.1725) (end 2.8935 3.1725) (layer F.SilkS) (width 0.12))
  (fp_line (start 2.8935 3.1725) (end -2.8935 3.1725) (layer F.SilkS) (width 0.12))
  (fp_line (start -2.8935 3.1725) (end -2.8935 -2.1725) (layer F.SilkS) (width 0.12))
  (pad A1 smd circle (at -2.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A2 smd circle (at -2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A3 smd circle (at -1.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A4 smd circle (at -1.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A5 smd circle (at -0.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A6 smd circle (at -0.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A7 smd circle (at 0 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A8 smd circle (at 0.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A9 smd circle (at 0.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A10 smd circle (at 1.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A11 smd circle (at 1.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A12 smd circle (at 2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A13 smd circle (at 2.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B1 smd circle (at -2.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B2 smd circle (at -2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B3 smd circle (at -1.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B4 smd circle (at -1.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B5 smd circle (at -0.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B6 smd circle (at -0.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B7 smd circle (at 0 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B8 smd circle (at 0.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B9 smd circle (at 0.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B10 smd circle (at 1.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B11 smd circle (at 1.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B12 smd circle (at 2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B13 smd circle (at 2.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C1 smd circle (at -2.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C2 smd circle (at -2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C3 smd circle (at -1.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C4 smd circle (at -1.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C5 smd circle (at -0.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C6 smd circle (at -0.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C7 smd circle (at 0 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C8 smd circle (at 0.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C9 smd circle (at 0.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C10 smd circle (at 1.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C11 smd circle (at 1.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C12 smd circle (at 2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C13 smd circle (at 2.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D1 smd circle (at -2.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D2 smd circle (at -2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D3 smd circle (at -1.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D4 smd circle (at -1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D5 smd circle (at -0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D6 smd circle (at -0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D7 smd circle (at 0 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D8 smd circle (at 0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D9 smd circle (at 0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D10 smd circle (at 1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D11 smd circle (at 1.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D12 smd circle (at 2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D13 smd circle (at 2.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E1 smd circle (at -2.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E2 smd circle (at -2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E3 smd circle (at -1.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E4 smd circle (at -1.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E5 smd circle (at -0.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E6 smd circle (at -0.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E7 smd circle (at 0 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E8 smd circle (at 0.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E9 smd circle (at 0.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E10 smd circle (at 1.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E11 smd circle (at 1.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E12 smd circle (at 2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E13 smd circle (at 2.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F1 smd circle (at -2.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F2 smd circle (at -2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F3 smd circle (at -1.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F4 smd circle (at -1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F5 smd circle (at -0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F6 smd circle (at -0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F7 smd circle (at 0 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F8 smd circle (at 0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F9 smd circle (at 0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F10 smd circle (at 1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F11 smd circle (at 1.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F12 smd circle (at 2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F13 smd circle (at 2.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G1 smd circle (at -2.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G2 smd circle (at -2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G3 smd circle (at -1.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G4 smd circle (at -1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G5 smd circle (at -0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G6 smd circle (at -0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G8 smd circle (at 0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G9 smd circle (at 0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G10 smd circle (at 1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G11 smd circle (at 1.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G12 smd circle (at 2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G13 smd circle (at 2.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H1 smd circle (at -2.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H2 smd circle (at -2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H3 smd circle (at -1.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H4 smd circle (at -1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H5 smd circle (at -0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H6 smd circle (at -0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H8 smd circle (at 0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H9 smd circle (at 0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H10 smd circle (at 1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H11 smd circle (at 1.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H12 smd circle (at 2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H13 smd circle (at 2.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J1 smd circle (at -2.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J2 smd circle (at -2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J3 smd circle (at -1.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J4 smd circle (at -1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J5 smd circle (at -0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J6 smd circle (at -0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J7 smd circle (at 0 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J8 smd circle (at 0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J9 smd circle (at 0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J10 smd circle (at 1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J11 smd circle (at 1.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J12 smd circle (at 2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J13 smd circle (at 2.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K1 smd circle (at -2.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K2 smd circle (at -2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K3 smd circle (at -1.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K4 smd circle (at -1.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K5 smd circle (at -0.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K6 smd circle (at -0.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K7 smd circle (at 0 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K8 smd circle (at 0.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K9 smd circle (at 0.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K10 smd circle (at 1.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K11 smd circle (at 1.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K12 smd circle (at 2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K13 smd circle (at 2.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L1 smd circle (at -2.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L2 smd circle (at -2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L3 smd circle (at -1.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L4 smd circle (at -1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L5 smd circle (at -0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L6 smd circle (at -0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L7 smd circle (at 0 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L8 smd circle (at 0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L9 smd circle (at 0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L10 smd circle (at 1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L11 smd circle (at 1.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L12 smd circle (at 2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L13 smd circle (at 2.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M1 smd circle (at -2.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M2 smd circle (at -2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M3 smd circle (at -1.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M4 smd circle (at -1.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M5 smd circle (at -0.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M6 smd circle (at -0.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M7 smd circle (at 0 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M8 smd circle (at 0.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M9 smd circle (at 0.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M10 smd circle (at 1.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M11 smd circle (at 1.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M12 smd circle (at 2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M13 smd circle (at 2.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N1 smd circle (at -2.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N2 smd circle (at -2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N3 smd circle (at -1.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N4 smd circle (at -1.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N5 smd circle (at -0.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N6 smd circle (at -0.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N7 smd circle (at 0 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N8 smd circle (at 0.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N9 smd circle (at 0.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N10 smd circle (at 1.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N11 smd circle (at 1.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N12 smd circle (at 2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N13 smd circle (at 2.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P1 smd circle (at -2.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P2 smd circle (at -2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P3 smd circle (at -1.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P4 smd circle (at -1.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P5 smd circle (at -0.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P6 smd circle (at -0.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P7 smd circle (at 0 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P8 smd circle (at 0.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P9 smd circle (at 0.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P10 smd circle (at 1.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P11 smd circle (at 1.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P12 smd circle (at 2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad P13 smd circle (at 2.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-180_Die451.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)