(module LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias (layer F.Cu) (tedit 5DB4AA4F)
  (descr "LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
  (tags "LFCSP-WD NoLead")
  (attr smd)
  (fp_text reference REF** (at 0 -2.45) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias (at 0 2.45) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 0 -1.61) (end 1.5 -1.61) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.5 1.61) (end 1.5 1.61) (layer F.SilkS) (width 0.12))
  (fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
  (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
  (fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
  (fp_line (start -1.5 1.5) (end -1.5 -0.75) (layer F.Fab) (width 0.1))
  (fp_line (start -1.5 -0.75) (end -0.75 -1.5) (layer F.Fab) (width 0.1))
  (fp_line (start -2.12 -1.75) (end -2.12 1.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.12 1.75) (end 2.12 1.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.12 1.75) (end 2.12 -1.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.12 -1.75) (end -2.12 -1.75) (layer F.CrtYd) (width 0.05))
  (pad 11 smd roundrect (at 0 0) (size 1.64 2.38) (layers F.Cu F.Mask) (roundrect_rratio 0.152439))
  (pad 11 thru_hole circle (at -0.52 -0.89) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 11 thru_hole circle (at 0.52 -0.89) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 11 thru_hole circle (at -0.52 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 11 thru_hole circle (at 0.52 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 11 thru_hole circle (at -0.52 0.89) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 11 thru_hole circle (at 0.52 0.89) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 11 smd roundrect (at 0 0) (size 1.64 2.38) (layers B.Cu) (roundrect_rratio 0.152439))
  (pad "" smd roundrect (at -0.41 -0.79) (size 0.71 0.69) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at -0.41 0) (size 0.71 0.69) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at -0.41 0.79) (size 0.71 0.69) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at 0.41 -0.79) (size 0.71 0.69) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at 0.41 0) (size 0.71 0.69) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at 0.41 0.79) (size 0.71 0.69) (layers F.Paste) (roundrect_rratio 0.25))
  (pad 1 smd roundrect (at -1.4475 -1) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -1.4475 -0.5) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -1.4475 0) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -1.4475 0.5) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -1.4475 1) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at 1.4475 1) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at 1.4475 0.5) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 8 smd roundrect (at 1.4475 0) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 9 smd roundrect (at 1.4475 -0.5) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (pad 10 smd roundrect (at 1.4475 -1) (size 0.855 0.25) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.75 0.75) (thickness 0.11)))
  )
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)