(module ST_WLCSP-36_Die458 (layer F.Cu) (tedit 5AE11EAD) (descr "WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf") (tags "BGA 36 0.4") (attr smd) (fp_text reference REF** (at 0 -2.2895) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value ST_WLCSP-36_Die458 (at 0 2.2895) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start 1.2765 1.2895) (end -1.2765 1.2895) (layer F.Fab) (width 0.1)) (fp_line (start -1.2765 1.2895) (end -1.2765 -0.65125) (layer F.Fab) (width 0.1)) (fp_line (start -1.2765 -0.65125) (end -0.63825 -1.2895) (layer F.Fab) (width 0.1)) (fp_line (start -0.63825 -1.2895) (end 1.2765 -1.2895) (layer F.Fab) (width 0.1)) (fp_line (start 1.2765 -1.2895) (end 1.2765 1.2895) (layer F.Fab) (width 0.1)) (fp_line (start -2.28 -2.29) (end -2.28 2.29) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.28 2.29) (end 2.28 2.29) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.28 2.29) (end 2.28 -2.29) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.28 -2.29) (end -2.28 -2.29) (layer F.CrtYd) (width 0.05)) (fp_line (start -0.76325 -1.4145) (end 1.4015 -1.4145) (layer F.SilkS) (width 0.12)) (fp_line (start 1.4015 -1.4145) (end 1.4015 1.4145) (layer F.SilkS) (width 0.12)) (fp_line (start 1.4015 1.4145) (end -1.4015 1.4145) (layer F.SilkS) (width 0.12)) (fp_line (start -1.4015 1.4145) (end -1.4015 -0.77625) (layer F.SilkS) (width 0.12)) (pad A1 smd circle (at -1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad A2 smd circle (at -0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad A3 smd circle (at -0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad A4 smd circle (at 0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad A5 smd circle (at 0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad A6 smd circle (at 1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad B1 smd circle (at -1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad B2 smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad B3 smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad B4 smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad B5 smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad B6 smd circle (at 1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad C1 smd circle (at -1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad C2 smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad C3 smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad C4 smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad C5 smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad C6 smd circle (at 1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad D1 smd circle (at -1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad D2 smd circle (at -0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad D3 smd circle (at -0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad D4 smd circle (at 0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad D5 smd circle (at 0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad D6 smd circle (at 1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad E1 smd circle (at -1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad E2 smd circle (at -0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad E3 smd circle (at -0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad E4 smd circle (at 0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad E5 smd circle (at 0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad E6 smd circle (at 1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad F1 smd circle (at -1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad F2 smd circle (at -0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad F3 smd circle (at -0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad F4 smd circle (at 0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad F5 smd circle (at 0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (pad F6 smd circle (at 1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste) (solder_paste_margin_ratio 0.055556)) (fp_text user %R (at 0 0) (layer F.Fab) (effects (font (size 0.59 0.59) (thickness 0.0885))) ) (model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-36_Die458.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )