(module ST_WLCSP-25_Die457 (layer F.Cu) (tedit 5AE11EAD)
  (descr "WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf")
  (tags "BGA 25 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -2.035) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value ST_WLCSP-25_Die457 (at 0 2.035) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.0665 1.035) (end -1.0665 1.035) (layer F.Fab) (width 0.1))
  (fp_line (start -1.0665 1.035) (end -1.0665 -0.5175) (layer F.Fab) (width 0.1))
  (fp_line (start -1.0665 -0.5175) (end -0.549 -1.035) (layer F.Fab) (width 0.1))
  (fp_line (start -0.549 -1.035) (end 1.0665 -1.035) (layer F.Fab) (width 0.1))
  (fp_line (start 1.0665 -1.035) (end 1.0665 1.035) (layer F.Fab) (width 0.1))
  (fp_line (start -2.07 -2.04) (end -2.07 2.04) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.07 2.04) (end 2.07 2.04) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.07 2.04) (end 2.07 -2.04) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.07 -2.04) (end -2.07 -2.04) (layer F.CrtYd) (width 0.05))
  (fp_line (start -0.674 -1.16) (end 1.1915 -1.16) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.1915 -1.16) (end 1.1915 1.16) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.1915 1.16) (end -1.1915 1.16) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.1915 1.16) (end -1.1915 -0.6425) (layer F.SilkS) (width 0.12))
  (pad A1 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A2 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A3 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A4 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A5 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B1 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B2 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B3 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B4 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B5 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C1 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C2 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C3 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C4 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C5 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D1 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D2 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D3 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D4 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D5 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E1 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E2 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E3 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E4 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E5 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.5 0.5) (thickness 0.075)))
  )
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-25_Die457.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)