(module DFN-S-8-1EP_6x5mm_P1.27mm (layer F.Cu) (tedit 5EA4C14B) (descr "8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)") (tags "DFN 1.27") (attr smd) (fp_text reference REF** (at 0 -3.575) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value DFN-S-8-1EP_6x5mm_P1.27mm (at 0 3.575) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 0) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2 -2.5) (end 3 -2.5) (layer F.Fab) (width 0.15)) (fp_line (start 3 -2.5) (end 3 2.5) (layer F.Fab) (width 0.15)) (fp_line (start 3 2.5) (end -3 2.5) (layer F.Fab) (width 0.15)) (fp_line (start -3 2.5) (end -3 -1.5) (layer F.Fab) (width 0.15)) (fp_line (start -3 -1.5) (end -2 -2.5) (layer F.Fab) (width 0.15)) (fp_line (start -3.6 -2.85) (end -3.6 2.85) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.6 -2.85) (end 3.6 2.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.6 -2.85) (end 3.6 -2.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.6 2.85) (end 3.6 2.85) (layer F.CrtYd) (width 0.05)) (fp_line (start -3 2.65) (end 3 2.65) (layer F.SilkS) (width 0.15)) (fp_line (start -1.2 -2.65) (end 3 -2.65) (layer F.SilkS) (width 0.15)) (pad 1 smd oval (at -2.8 -1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 2 smd oval (at -2.8 -0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 3 smd oval (at -2.8 0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 4 smd oval (at -2.8 1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 5 smd oval (at 2.8 1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 6 smd oval (at 2.8 0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 7 smd oval (at 2.8 -0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 8 smd oval (at 2.8 -1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 0.6 1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at 0.6 0.512499) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at 0.6 -0.5125) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at 0.6 -1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at -0.6 1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at -0.6 0.512499) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at -0.6 -0.5125) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 9 smd rect (at -0.6 -1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/DFN-S-8-1EP_6x5mm_P1.27mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )