(module ST_WLCSP-144_Die470 (layer F.Cu) (tedit 5AE11EAD)
  (descr "WLCSP-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf")
  (tags "BGA 144 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -3.62) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value ST_WLCSP-144_Die470 (at 0 3.62) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 2.62 2.62) (end -2.62 2.62) (layer F.Fab) (width 0.1))
  (fp_line (start -2.62 2.62) (end -2.62 -1.62) (layer F.Fab) (width 0.1))
  (fp_line (start -2.62 -1.62) (end -1.62 -2.62) (layer F.Fab) (width 0.1))
  (fp_line (start -1.62 -2.62) (end 2.62 -2.62) (layer F.Fab) (width 0.1))
  (fp_line (start 2.62 -2.62) (end 2.62 2.62) (layer F.Fab) (width 0.1))
  (fp_line (start -3.62 -3.62) (end -3.62 3.62) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.62 3.62) (end 3.62 3.62) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.62 3.62) (end 3.62 -3.62) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.62 -3.62) (end -3.62 -3.62) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.745 -2.745) (end 2.745 -2.745) (layer F.SilkS) (width 0.12))
  (fp_line (start 2.745 -2.745) (end 2.745 2.745) (layer F.SilkS) (width 0.12))
  (fp_line (start 2.745 2.745) (end -2.745 2.745) (layer F.SilkS) (width 0.12))
  (fp_line (start -2.745 2.745) (end -2.745 -1.745) (layer F.SilkS) (width 0.12))
  (pad A1 smd circle (at -2.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A2 smd circle (at -1.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A3 smd circle (at -1.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A4 smd circle (at -1 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A5 smd circle (at -0.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A6 smd circle (at -0.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A7 smd circle (at 0.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A8 smd circle (at 0.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A9 smd circle (at 1 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A10 smd circle (at 1.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A11 smd circle (at 1.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A12 smd circle (at 2.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B1 smd circle (at -2.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B2 smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B3 smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B4 smd circle (at -1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B5 smd circle (at -0.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B6 smd circle (at -0.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B7 smd circle (at 0.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B8 smd circle (at 0.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B9 smd circle (at 1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B10 smd circle (at 1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B11 smd circle (at 1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B12 smd circle (at 2.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C1 smd circle (at -2.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C2 smd circle (at -1.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C3 smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C4 smd circle (at -1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C5 smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C6 smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C7 smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C8 smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C9 smd circle (at 1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C10 smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C11 smd circle (at 1.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C12 smd circle (at 2.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D1 smd circle (at -2.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D2 smd circle (at -1.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D3 smd circle (at -1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D4 smd circle (at -1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D5 smd circle (at -0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D6 smd circle (at -0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D7 smd circle (at 0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D8 smd circle (at 0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D9 smd circle (at 1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D10 smd circle (at 1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D11 smd circle (at 1.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D12 smd circle (at 2.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E1 smd circle (at -2.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E2 smd circle (at -1.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E3 smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E4 smd circle (at -1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E5 smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E6 smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E7 smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E8 smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E9 smd circle (at 1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E10 smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E11 smd circle (at 1.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E12 smd circle (at 2.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F1 smd circle (at -2.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F2 smd circle (at -1.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F3 smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F4 smd circle (at -1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F5 smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F6 smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F7 smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F8 smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F9 smd circle (at 1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F10 smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F11 smd circle (at 1.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F12 smd circle (at 2.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G1 smd circle (at -2.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G2 smd circle (at -1.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G3 smd circle (at -1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G4 smd circle (at -1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G5 smd circle (at -0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G6 smd circle (at -0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G7 smd circle (at 0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G8 smd circle (at 0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G9 smd circle (at 1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G10 smd circle (at 1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G11 smd circle (at 1.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G12 smd circle (at 2.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H1 smd circle (at -2.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H2 smd circle (at -1.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H3 smd circle (at -1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H4 smd circle (at -1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H5 smd circle (at -0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H6 smd circle (at -0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H7 smd circle (at 0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H8 smd circle (at 0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H9 smd circle (at 1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H10 smd circle (at 1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H11 smd circle (at 1.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H12 smd circle (at 2.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J1 smd circle (at -2.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J2 smd circle (at -1.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J3 smd circle (at -1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J4 smd circle (at -1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J5 smd circle (at -0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J6 smd circle (at -0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J7 smd circle (at 0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J8 smd circle (at 0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J9 smd circle (at 1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J10 smd circle (at 1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J11 smd circle (at 1.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J12 smd circle (at 2.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K1 smd circle (at -2.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K2 smd circle (at -1.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K3 smd circle (at -1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K4 smd circle (at -1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K5 smd circle (at -0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K6 smd circle (at -0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K7 smd circle (at 0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K8 smd circle (at 0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K9 smd circle (at 1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K10 smd circle (at 1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K11 smd circle (at 1.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K12 smd circle (at 2.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L1 smd circle (at -2.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L2 smd circle (at -1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L3 smd circle (at -1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L4 smd circle (at -1 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L5 smd circle (at -0.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L6 smd circle (at -0.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L7 smd circle (at 0.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L8 smd circle (at 0.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L9 smd circle (at 1 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L10 smd circle (at 1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L11 smd circle (at 1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L12 smd circle (at 2.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M1 smd circle (at -2.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M2 smd circle (at -1.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M3 smd circle (at -1.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M4 smd circle (at -1 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M5 smd circle (at -0.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M6 smd circle (at -0.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M7 smd circle (at 0.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M8 smd circle (at 0.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M9 smd circle (at 1 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M10 smd circle (at 1.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M11 smd circle (at 1.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M12 smd circle (at 2.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-144_Die470.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)