(module ST_WLCSP-143_Die449 (layer F.Cu) (tedit 5AE11EAD)
  (descr "WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf")
  (tags "BGA 143 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -3.9245) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value ST_WLCSP-143_Die449 (at 0 3.9245) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 2.2695 2.9245) (end -2.2695 2.9245) (layer F.Fab) (width 0.1))
  (fp_line (start -2.2695 2.9245) (end -2.2695 -1.9245) (layer F.Fab) (width 0.1))
  (fp_line (start -2.2695 -1.9245) (end -1.2695 -2.9245) (layer F.Fab) (width 0.1))
  (fp_line (start -1.2695 -2.9245) (end 2.2695 -2.9245) (layer F.Fab) (width 0.1))
  (fp_line (start 2.2695 -2.9245) (end 2.2695 2.9245) (layer F.Fab) (width 0.1))
  (fp_line (start -3.27 -3.93) (end -3.27 3.93) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.27 3.93) (end 3.27 3.93) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.27 3.93) (end 3.27 -3.93) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.27 -3.93) (end -3.27 -3.93) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.3945 -3.0495) (end 2.3945 -3.0495) (layer F.SilkS) (width 0.12))
  (fp_line (start 2.3945 -3.0495) (end 2.3945 3.0495) (layer F.SilkS) (width 0.12))
  (fp_line (start 2.3945 3.0495) (end -2.3945 3.0495) (layer F.SilkS) (width 0.12))
  (fp_line (start -2.3945 3.0495) (end -2.3945 -2.0495) (layer F.SilkS) (width 0.12))
  (pad A1 smd circle (at -2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A2 smd circle (at -1.6 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A3 smd circle (at -1.2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A4 smd circle (at -0.8 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A5 smd circle (at -0.4 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A6 smd circle (at 0 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A7 smd circle (at 0.4 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A8 smd circle (at 0.8 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A9 smd circle (at 1.2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A10 smd circle (at 1.6 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad A11 smd circle (at 2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B1 smd circle (at -2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B2 smd circle (at -1.6 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B3 smd circle (at -1.2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B4 smd circle (at -0.8 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B5 smd circle (at -0.4 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B6 smd circle (at 0 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B7 smd circle (at 0.4 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B8 smd circle (at 0.8 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B9 smd circle (at 1.2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B10 smd circle (at 1.6 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad B11 smd circle (at 2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C1 smd circle (at -2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C2 smd circle (at -1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C3 smd circle (at -1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C4 smd circle (at -0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C5 smd circle (at -0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C6 smd circle (at 0 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C7 smd circle (at 0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C8 smd circle (at 0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C9 smd circle (at 1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C10 smd circle (at 1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad C11 smd circle (at 2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D1 smd circle (at -2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D2 smd circle (at -1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D3 smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D4 smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D5 smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D6 smd circle (at 0 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D7 smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D8 smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D9 smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D10 smd circle (at 1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad D11 smd circle (at 2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E1 smd circle (at -2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E2 smd circle (at -1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E3 smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E4 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E5 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E6 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E7 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E8 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E9 smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E10 smd circle (at 1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad E11 smd circle (at 2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F1 smd circle (at -2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F2 smd circle (at -1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F3 smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F4 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F5 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F6 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F7 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F8 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F9 smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F10 smd circle (at 1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad F11 smd circle (at 2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G1 smd circle (at -2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G2 smd circle (at -1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G3 smd circle (at -1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G4 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G5 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G6 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G7 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G8 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G9 smd circle (at 1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G10 smd circle (at 1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad G11 smd circle (at 2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H1 smd circle (at -2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H2 smd circle (at -1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H3 smd circle (at -1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H4 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H5 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H6 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H7 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H8 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H9 smd circle (at 1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H10 smd circle (at 1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad H11 smd circle (at 2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J1 smd circle (at -2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J2 smd circle (at -1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J3 smd circle (at -1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J4 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J5 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J6 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J7 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J8 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J9 smd circle (at 1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J10 smd circle (at 1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad J11 smd circle (at 2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K1 smd circle (at -2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K2 smd circle (at -1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K3 smd circle (at -1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K4 smd circle (at -0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K5 smd circle (at -0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K6 smd circle (at 0 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K7 smd circle (at 0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K8 smd circle (at 0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K9 smd circle (at 1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K10 smd circle (at 1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad K11 smd circle (at 2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L1 smd circle (at -2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L2 smd circle (at -1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L3 smd circle (at -1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L4 smd circle (at -0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L5 smd circle (at -0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L6 smd circle (at 0 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L7 smd circle (at 0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L8 smd circle (at 0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L9 smd circle (at 1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L10 smd circle (at 1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad L11 smd circle (at 2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M1 smd circle (at -2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M2 smd circle (at -1.6 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M3 smd circle (at -1.2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M4 smd circle (at -0.8 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M5 smd circle (at -0.4 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M6 smd circle (at 0 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M7 smd circle (at 0.4 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M8 smd circle (at 0.8 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M9 smd circle (at 1.2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M10 smd circle (at 1.6 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad M11 smd circle (at 2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N1 smd circle (at -2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N2 smd circle (at -1.6 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N3 smd circle (at -1.2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N4 smd circle (at -0.8 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N5 smd circle (at -0.4 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N6 smd circle (at 0 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N7 smd circle (at 0.4 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N8 smd circle (at 0.8 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N9 smd circle (at 1.2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N10 smd circle (at 1.6 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (pad N11 smd circle (at 2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
    (solder_paste_margin_ratio 0.055556))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-143_Die449.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)