(module WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm (layer F.Cu) (tedit 5B5DBBC6)
  (descr "WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf")
  (tags "BGA 56 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -2.722) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm (at 0 2.722) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.585 1.722) (end -1.585 1.722) (layer F.Fab) (width 0.1))
  (fp_line (start -1.585 1.722) (end -1.585 -0.9295) (layer F.Fab) (width 0.1))
  (fp_line (start -1.585 -0.9295) (end -0.7925 -1.722) (layer F.Fab) (width 0.1))
  (fp_line (start -0.7925 -1.722) (end 1.585 -1.722) (layer F.Fab) (width 0.1))
  (fp_line (start 1.585 -1.722) (end 1.585 1.722) (layer F.Fab) (width 0.1))
  (fp_line (start -2.59 -2.73) (end -2.59 2.73) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.59 2.73) (end 2.59 2.73) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.59 2.73) (end 2.59 -2.73) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.59 -2.73) (end -2.59 -2.73) (layer F.CrtYd) (width 0.05))
  (fp_line (start -0.9175 -1.847) (end 1.71 -1.847) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.71 -1.847) (end 1.71 1.847) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.71 1.847) (end -1.71 1.847) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.71 1.847) (end -1.71 -1.0545) (layer F.SilkS) (width 0.12))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.74 0.74) (thickness 0.111)))
  )
  (pad A1 smd circle (at -1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad A2 smd circle (at -0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad A3 smd circle (at -0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad A4 smd circle (at 0 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad A5 smd circle (at 0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad A6 smd circle (at 0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad A7 smd circle (at 1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B1 smd circle (at -1.2 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B2 smd circle (at -0.8 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B3 smd circle (at -0.4 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B4 smd circle (at 0 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B5 smd circle (at 0.4 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B6 smd circle (at 0.8 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad B7 smd circle (at 1.2 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C1 smd circle (at -1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C2 smd circle (at -0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C3 smd circle (at -0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C4 smd circle (at 0 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C5 smd circle (at 0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C6 smd circle (at 0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad C7 smd circle (at 1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D1 smd circle (at -1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D2 smd circle (at -0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D3 smd circle (at -0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D4 smd circle (at 0 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D5 smd circle (at 0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D6 smd circle (at 0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad D7 smd circle (at 1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E1 smd circle (at -1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E2 smd circle (at -0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E3 smd circle (at -0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E4 smd circle (at 0 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E5 smd circle (at 0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E6 smd circle (at 0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad E7 smd circle (at 1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F1 smd circle (at -1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F2 smd circle (at -0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F3 smd circle (at -0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F4 smd circle (at 0 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F5 smd circle (at 0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F6 smd circle (at 0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad F7 smd circle (at 1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G1 smd circle (at -1.2 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G2 smd circle (at -0.8 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G3 smd circle (at -0.4 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G4 smd circle (at 0 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G5 smd circle (at 0.4 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G6 smd circle (at 0.8 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad G7 smd circle (at 1.2 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H1 smd circle (at -1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H2 smd circle (at -0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H3 smd circle (at -0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H4 smd circle (at 0 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H5 smd circle (at 0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H6 smd circle (at 0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (pad H7 smd circle (at 1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio 0.055556))
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)