(module Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm (layer F.Cu) (tedit 5C2BC203)
  (descr "WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf")
  (tags "BGA 8 0.4")
  (solder_mask_margin 0.035)
  (solder_paste_margin 0.000001)
  (attr smd)
  (fp_text reference REF** (at 0 -2.546) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm (at 0 2.546) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.14 1.546) (end -1.14 1.546) (layer F.Fab) (width 0.1))
  (fp_line (start -1.14 1.546) (end -1.14 -0.976) (layer F.Fab) (width 0.1))
  (fp_line (start -1.14 -0.976) (end -0.57 -1.546) (layer F.Fab) (width 0.1))
  (fp_line (start -0.57 -1.546) (end 1.14 -1.546) (layer F.Fab) (width 0.1))
  (fp_line (start 1.14 -1.546) (end 1.14 1.546) (layer F.Fab) (width 0.1))
  (fp_line (start -2.14 -2.55) (end -2.14 2.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.14 2.55) (end 2.14 2.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.14 2.55) (end 2.14 -2.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.14 -2.55) (end -2.14 -2.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -0.68 -1.656) (end 1.25 -1.656) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.25 -1.656) (end 1.25 1.656) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.25 1.656) (end -1.25 1.656) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.25 1.656) (end -1.25 -1.086) (layer F.SilkS) (width 0.12))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.53 0.53) (thickness 0.0795)))
  )
  (pad A1 smd circle (at -0.4 -0.6) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad A3 smd circle (at 0.4 -0.6) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad B2 smd circle (at 0 -0.3) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad C1 smd circle (at -0.4 0) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad C3 smd circle (at 0.4 0) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad D2 smd circle (at 0 0.3) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad E1 smd circle (at -0.4 0.6) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (pad E3 smd circle (at 0.4 0.6) (size 0.25 0.25) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_BGA.3dshapes/Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)