(footprint "Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm" (version 20211014) (generator pcbnew)
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  (tedit 5A7A2488)
  (descr "Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)")
  (tags "Texas Instruments DSBGA BGA")
  (solder_mask_margin 0.05)
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    (tstamp e8a6ab64-27fc-4c6c-a4b6-588ea5018cc0)
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    (tstamp 769971a2-eec2-4fcb-ae4d-a1e7d031b12b)
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  (pad "B3" smd circle (at 0.5 -0.25) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 6512d9a6-7041-4378-bcd3-9b6eac253816))
  (pad "C1" smd circle (at -0.5 0.25) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 1c81e842-0309-4241-91fd-85dcb7d0ebc3))
  (pad "C3" smd circle (at 0.5 0.25) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 980809fc-8807-455b-9827-b1e3e355ffd0))
  (pad "D1" smd circle (at -0.5 0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 810b8eba-8f5c-4d0a-896e-0360c2f6e969))
  (pad "D2" smd circle (at 0 0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 9acdcfdb-1190-442c-8c55-07d009bc97e6))
  (pad "D3" smd circle (at 0.5 0.75) (size 0.265 0.265) (layers "F.Cu" "F.Mask") (tstamp 12b05a8c-6027-48c8-8f4e-f55f373b4a2a))
  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)