(footprint "Xilinx_CLG484_CLG485" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5CDADFA9)
  (descr "Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A")
  (tags "BGA 484 0.8 CLG484 CL484 CLG485 CL485")
  (solder_mask_margin 0.05)
  (attr smd)
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    (tstamp f6da44ff-2c53-4c05-848c-a7c3fe5c447e)
  )
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    (tstamp a0a1beec-ed03-4755-becb-074f8c263aa9)
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  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Xilinx_CLG484_CLG485.wrl"
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    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
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)