(footprint "Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0AA1EB)
  (descr "Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)")
  (tags "Texas Instruments DSBGA BGA YZP R-XBGA-N8")
  (solder_mask_margin 0.05)
  (attr smd)
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    (tstamp 46f505d6-8e99-4486-a536-e1cb7abea474)
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    (tstamp 90bd7006-d1b2-4636-94ff-7a0dd64d53d7)
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  (pad "A1" smd circle (at -0.5 -0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 47d4848d-227e-4a4a-85b0-63a311f3266d))
  (pad "A2" smd circle (at 0 -0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp f55281d3-aebe-4915-ba75-0a01919bfd4a))
  (pad "A3" smd circle (at 0.5 -0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 2011290b-0fda-4f0a-9dcf-0a158f217a13))
  (pad "B1" smd circle (at -0.5 0) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 664ceb7d-18a2-4e7e-a3d2-f0796a6c79da))
  (pad "B3" smd circle (at 0.5 0) (size 0.165 0.165) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 66b51935-250d-40f6-b392-3106b7ef5634))
  (pad "C1" smd circle (at -0.5 0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 07050a87-ad19-446c-9568-1152dfd5bc91))
  (pad "C2" smd circle (at 0 0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp 487ab774-85b3-410d-8e86-87df3edfeb60))
  (pad "C3" smd circle (at 0.5 0.5) (size 0.165 0.165) (layers "F.Cu" "F.Mask") (tstamp ccac8d16-cd4c-4ef0-abbc-12a6fd7b0238))
  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)