(footprint "TestPoint_THTPad_D2.5mm_Drill1.2mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0F774F)
  (descr "THT pad as test Point, diameter 2.5mm, hole diameter 1.2mm ")
  (tags "test point THT pad")
  (attr exclude_from_pos_files exclude_from_bom)
  (fp_text reference "REF**" (at 0 -2.148) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 56df4956-61eb-4698-8712-2fb120b46ffd)
  )
  (fp_text value "TestPoint_THTPad_D2.5mm_Drill1.2mm" (at 0 2.25) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp abef568a-df64-4131-be8d-137eda5731b3)
  )
  (fp_text user "${REFERENCE}" (at 0 -2.15) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4436b8aa-1304-4e20-834f-d4edb98b867c)
  )
  (fp_circle (center 0 0) (end 0 1.45) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 4796ca76-4db9-4821-8dfa-215851f29e65))
  (fp_circle (center 0 0) (end 1.75 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 6d73eca4-df1e-4f55-a5b0-26b293dde5f3))
  (pad "1" thru_hole circle (at 0 0) (size 2.5 2.5) (drill 1.2) (layers *.Cu *.Mask) (tstamp 3a80aa7f-2be2-4706-bf64-f991edd9504b))
)