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updated to v6 libs

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willem
2022-02-02 13:54:01 +01:00
parent fc6ede2d05
commit fd6b549f71
7851 changed files with 3059326 additions and 1092824 deletions
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kicad-footprints/Package_SO.pretty/TSSOP-28-1EP_4.4x9.7mm_P0.65mm.kicad_mod
+71 -66
View File
@@ -1,78 +1,83 @@
(module TSSOP-28-1EP_4.4x9.7mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
(footprint "TSSOP-28-1EP_4.4x9.7mm_P0.65mm" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5A02F25C)
(descr "TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -5.9) (layer F.SilkS)
(fp_text reference "REF**" (at 0 -5.9) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 2f63d754-c083-495d-a57d-aacf3018baf3)
)
(fp_text value TSSOP-28-1EP_4.4x9.7mm_P0.65mm (at 0 5.9) (layer F.Fab)
(fp_text value "TSSOP-28-1EP_4.4x9.7mm_P0.65mm" (at 0 5.9) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ec0e3b60-d9b5-4b0f-9ec0-ba4e05c457b4)
)
(fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer F.Fab) (width 0.15))
(fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer F.Fab) (width 0.15))
(fp_line (start 2.2 4.85) (end -2.2 4.85) (layer F.Fab) (width 0.15))
(fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer F.Fab) (width 0.15))
(fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer F.Fab) (width 0.15))
(fp_line (start -3.65 -5.15) (end -3.65 5.15) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.65 -5.15) (end 3.65 5.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.65 -5.15) (end 3.65 -5.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.65 5.15) (end 3.65 5.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.325 -4.975) (end -2.325 -4.75) (layer F.SilkS) (width 0.15))
(fp_line (start 2.325 -4.975) (end 2.325 -4.65) (layer F.SilkS) (width 0.15))
(fp_line (start 2.325 4.975) (end 2.325 4.65) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 4.975) (end -2.325 4.65) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 -4.975) (end 2.325 -4.975) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 4.975) (end 2.325 4.975) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 -4.75) (end -3.4 -4.75) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.8 0.8) (thickness 0.15)))
(tstamp b8a8355d-eb0d-4fb0-abf1-a6ff81b87cb4)
)
(pad 1 smd rect (at -2.85 -4.225) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.85 -3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -2.85 3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -2.85 4.225) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.85 4.225) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.85 3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at 2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at 2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at 2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at 2.85 -3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at 2.85 -4.225) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 0.6 2.31375) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.6 0.77125) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.6 -0.77125) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.6 -2.31375) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.6 2.31375) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.6 0.77125) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.6 -0.77125) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.6 -2.31375) (size 1.2 1.5425) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(fp_line (start 2.325 4.975) (end 2.325 4.65) (layer "F.SilkS") (width 0.15) (tstamp 1b832f02-a53b-460a-91cf-08f728fd83af))
(fp_line (start -2.325 -4.975) (end 2.325 -4.975) (layer "F.SilkS") (width 0.15) (tstamp 2136d948-4519-46e8-8c53-80aa83cbe116))
(fp_line (start -2.325 -4.75) (end -3.4 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 402a1e4d-02f1-4ff0-b1d1-93d2e91e6295))
(fp_line (start -2.325 -4.975) (end -2.325 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 6a672ba4-1e0e-4c8e-b862-0630a17a48c6))
(fp_line (start 2.325 -4.975) (end 2.325 -4.65) (layer "F.SilkS") (width 0.15) (tstamp 6bc094cd-eeec-4552-aed2-a54853d59bc0))
(fp_line (start -2.325 4.975) (end -2.325 4.65) (layer "F.SilkS") (width 0.15) (tstamp 8230348e-0b13-4b01-a6cf-8fe39b9d8c92))
(fp_line (start -2.325 4.975) (end 2.325 4.975) (layer "F.SilkS") (width 0.15) (tstamp c3d8a113-d313-4aff-a85b-5614b56d93d2))
(fp_line (start -3.65 -5.15) (end -3.65 5.15) (layer "F.CrtYd") (width 0.05) (tstamp 0eb154a5-4422-4b5b-b9de-fe3b8463e6d3))
(fp_line (start -3.65 5.15) (end 3.65 5.15) (layer "F.CrtYd") (width 0.05) (tstamp 41733395-b77f-4a36-9daf-51d35b6a623d))
(fp_line (start 3.65 -5.15) (end 3.65 5.15) (layer "F.CrtYd") (width 0.05) (tstamp 65ad8238-b872-4dac-9ade-bf014b76bd66))
(fp_line (start -3.65 -5.15) (end 3.65 -5.15) (layer "F.CrtYd") (width 0.05) (tstamp db9c34ed-d54e-443b-9342-7132737bc929))
(fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer "F.Fab") (width 0.15) (tstamp 1a64a5f4-ab8a-4a88-8879-e177704067c4))
(fp_line (start 2.2 4.85) (end -2.2 4.85) (layer "F.Fab") (width 0.15) (tstamp 929425e3-263c-42e9-a963-812d48e9b131))
(fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.15) (tstamp a7f5f017-878f-4fdf-b399-1bf1d28d8621))
(fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.15) (tstamp bc140972-6c1f-48a3-85f9-98f8194a449c))
(fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.15) (tstamp caf6ba19-6ab2-401e-84c9-07d056c785ee))
(pad "1" smd rect (at -2.85 -4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a3cf6ffd-a893-43d7-b0ea-c7016ce07be3))
(pad "2" smd rect (at -2.85 -3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f7140408-52d8-42bf-9fa9-5eafc6ac0e6e))
(pad "3" smd rect (at -2.85 -2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2a233007-7a24-4ea1-afee-fb2bd604d60f))
(pad "4" smd rect (at -2.85 -2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 606cfafc-8283-40da-88e1-b5b5b9fbd145))
(pad "5" smd rect (at -2.85 -1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 46c69f8e-5a84-47ed-b8b0-2f73620fb2bb))
(pad "6" smd rect (at -2.85 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp abdda84b-acd6-4df7-9d20-7ba2d74e876f))
(pad "7" smd rect (at -2.85 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e7243502-6658-417e-b365-65fcf3fb8cbf))
(pad "8" smd rect (at -2.85 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2f899e1-32a1-408a-9bcd-f3539b1d4212))
(pad "9" smd rect (at -2.85 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f37cd259-cd79-4176-b265-a7b1f703a1e8))
(pad "10" smd rect (at -2.85 1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c19e6c40-0840-4ccd-8d9e-c9dccef3aee4))
(pad "11" smd rect (at -2.85 2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 81b9acae-5590-4bf2-be51-6c2bcc4b8b0b))
(pad "12" smd rect (at -2.85 2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 45e5e8f5-4b51-47e9-a241-af55d1a697bf))
(pad "13" smd rect (at -2.85 3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a23ba147-89dc-4edc-add2-96b289cf763d))
(pad "14" smd rect (at -2.85 4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp aff0b798-4d63-4b0f-9b04-8fafbf0b5422))
(pad "15" smd rect (at 2.85 4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fdf7583f-40f1-42e5-85d3-a77fd1f8f64c))
(pad "16" smd rect (at 2.85 3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a61c4369-4d2f-4b9d-9968-463616206e19))
(pad "17" smd rect (at 2.85 2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8e9adacb-b747-430a-b01f-bfdaf3a565c2))
(pad "18" smd rect (at 2.85 2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e6e6960d-98b5-4c5c-b535-91634b676e8b))
(pad "19" smd rect (at 2.85 1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0cb5e048-6544-40ba-a36e-72ba7f9083ff))
(pad "20" smd rect (at 2.85 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 15991fca-f6ec-4c1f-b740-f8631828e0b0))
(pad "21" smd rect (at 2.85 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f2c734fd-5395-491e-a08a-fdbfaf10b09f))
(pad "22" smd rect (at 2.85 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp caa8d62b-daf6-4f95-b13e-70f60b44b139))
(pad "23" smd rect (at 2.85 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c4020e88-662d-4743-98d6-2c640ed7b8aa))
(pad "24" smd rect (at 2.85 -1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3232fa6f-01df-4150-8d4e-ad410ee7a775))
(pad "25" smd rect (at 2.85 -2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a4267800-5630-42b5-96bb-115209153779))
(pad "26" smd rect (at 2.85 -2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e3b324b8-6ae5-444d-843e-30d11feb9159))
(pad "27" smd rect (at 2.85 -3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4c76d366-6485-477e-b311-fa018b8f7cc9))
(pad "28" smd rect (at 2.85 -4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d14616e3-65e5-40ce-9b1e-93297444bbc9))
(pad "29" smd rect (at -0.6 -2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 247b2a5c-8916-4ccf-bec3-a24f3e9fd0d8))
(pad "29" smd rect (at -0.6 -0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 248174b4-f500-4316-b8f4-fda372d3e5e9))
(pad "29" smd rect (at -0.6 0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 248997f2-c686-4cb3-acd8-24837eb2e0d3))
(pad "29" smd rect (at -0.6 2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 8a7dfce6-66f5-49db-9f84-c9ceabd69c7e))
(pad "29" smd rect (at 0.6 2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp c10d22f2-8bba-4ece-9aa4-a47a39fc1b36))
(pad "29" smd rect (at 0.6 -0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp d4b322cc-9391-4e0b-a2af-a502c8c50f19))
(pad "29" smd rect (at 0.6 0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp e6e68165-5ae2-42c5-b8af-016fa621a0a7))
(pad "29" smd rect (at 0.6 -2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp f076fab1-81d3-4442-b085-b072306f77ec))
(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_Pitch0.65mm.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)