updated to v6 libs

This commit is contained in:
2022-02-02 13:54:01 +01:00
parent fc6ede2d05
commit fd6b549f71
7851 changed files with 3059326 additions and 1092824 deletions
@@ -1,59 +1,64 @@
(module Microchip_8E-16 (layer F.Cu) (tedit 5A0AA2C0)
(footprint "Microchip_8E-16" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5A0AA2C0)
(descr "16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFN Microchip 8E 16")
(solder_mask_margin 0.1)
(attr smd)
(fp_text reference REF** (at 0 -3.1) (layer F.SilkS)
(fp_text reference "REF**" (at 0 -3.1) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a9fc2f0c-de44-454d-9de8-3b22bd6cf7ef)
)
(fp_text value Microchip_8E-16 (at 0 3.1) (layer F.Fab)
(fp_text value "Microchip_8E-16" (at 0 3.1) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 0a3a330d-94c1-4bef-af22-52890ff0651c)
)
(fp_text user %R (at 0 0) (layer F.Fab)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.8 0.8) (thickness 0.15)))
(tstamp 3457c8af-54a2-40de-b646-d63c395553e4)
)
(fp_line (start -2 2) (end -2 -1) (layer F.Fab) (width 0.1))
(fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.1))
(fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.1))
(fp_line (start -1 -2) (end 2 -2) (layer F.Fab) (width 0.1))
(fp_line (start -2.5 -2.5) (end -2.5 2.5) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.5 -2.5) (end 2.5 -2.5) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.5 2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.175 -2.175) (end 2.175 -1.375) (layer F.SilkS) (width 0.15))
(fp_line (start -2.175 2.175) (end -2.175 1.375) (layer F.SilkS) (width 0.15))
(fp_line (start 2.175 2.175) (end 2.175 1.375) (layer F.SilkS) (width 0.15))
(fp_line (start -2.175 -2.175) (end -1.375 -2.175) (layer F.SilkS) (width 0.15))
(fp_line (start -2.175 2.175) (end -1.375 2.175) (layer F.SilkS) (width 0.15))
(fp_line (start 2.175 2.175) (end 1.375 2.175) (layer F.SilkS) (width 0.15))
(fp_line (start 2.175 -2.175) (end 1.375 -2.175) (layer F.SilkS) (width 0.15))
(fp_line (start -1 -2) (end -2 -1) (layer F.Fab) (width 0.1))
(pad 1 smd rect (at -1.8125 -0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -1.8125 -0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -1.8125 0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -1.8125 0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -0.975 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -0.325 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 0.325 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 0.975 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 1.8125 0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 1.8125 0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 1.8125 -0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 1.8125 -0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 0.975 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 0.325 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -0.325 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -0.975 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0.5375 0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 17 smd rect (at 0.5375 -0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 17 smd rect (at -0.5375 0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 17 smd rect (at -0.5375 -0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-16-1EP_4x4mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(fp_line (start -2.175 2.175) (end -2.175 1.375) (layer "F.SilkS") (width 0.15) (tstamp 3c1404d1-2687-4b47-b341-b2abb17872bb))
(fp_line (start 2.175 -2.175) (end 2.175 -1.375) (layer "F.SilkS") (width 0.15) (tstamp cc5dfc44-a1b7-49da-94df-b0dd5a4986a4))
(fp_line (start -2.175 -2.175) (end -1.375 -2.175) (layer "F.SilkS") (width 0.15) (tstamp d51c8147-2eca-4218-9208-fb05e471ef63))
(fp_line (start -2.175 2.175) (end -1.375 2.175) (layer "F.SilkS") (width 0.15) (tstamp e880dee5-cd14-435c-8768-5dce08028964))
(fp_line (start 2.175 2.175) (end 1.375 2.175) (layer "F.SilkS") (width 0.15) (tstamp e8931c64-e563-4e5b-9ce8-919c59bc348b))
(fp_line (start 2.175 -2.175) (end 1.375 -2.175) (layer "F.SilkS") (width 0.15) (tstamp ed7bf669-98d1-436f-8cad-efe33e1b0041))
(fp_line (start 2.175 2.175) (end 2.175 1.375) (layer "F.SilkS") (width 0.15) (tstamp eec89892-c5e1-47a6-811b-e82aff263161))
(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer "F.CrtYd") (width 0.05) (tstamp 350a2a96-ce1c-483b-bcbf-a6bb0322b561))
(fp_line (start -2.5 -2.5) (end 2.5 -2.5) (layer "F.CrtYd") (width 0.05) (tstamp 7ec00b4a-fdd1-48d9-80d0-247b2dfe2e4c))
(fp_line (start -2.5 -2.5) (end -2.5 2.5) (layer "F.CrtYd") (width 0.05) (tstamp a57d4cc3-8df8-4d12-a017-edcadacd18e3))
(fp_line (start -2.5 2.5) (end 2.5 2.5) (layer "F.CrtYd") (width 0.05) (tstamp b62402d4-2f86-4fb9-a277-9b56a7083685))
(fp_line (start 2 -2) (end 2 2) (layer "F.Fab") (width 0.1) (tstamp 094390bb-5a10-4282-af38-f788bf2ef0d0))
(fp_line (start 2 2) (end -2 2) (layer "F.Fab") (width 0.1) (tstamp 7d8e7a19-d79b-41fe-8d2c-212b6a151e76))
(fp_line (start -2 2) (end -2 -1) (layer "F.Fab") (width 0.1) (tstamp 888a8354-6304-44e9-bd6d-695e67193e4a))
(fp_line (start -1 -2) (end -2 -1) (layer "F.Fab") (width 0.1) (tstamp 96ad3a01-45bc-4898-ab96-0fb09ecc0644))
(fp_line (start -1 -2) (end 2 -2) (layer "F.Fab") (width 0.1) (tstamp a412468c-bb3b-48ec-bf42-2d61d21655e4))
(pad "1" smd rect (at -1.8125 -0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d8c90caa-74f2-418e-8216-418d21b97a0c))
(pad "2" smd rect (at -1.8125 -0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e07d9178-08ad-45b1-b834-406a7ee973d4))
(pad "3" smd rect (at -1.8125 0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c215a064-3f42-45cc-9a69-f78b821e1cda))
(pad "4" smd rect (at -1.8125 0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2c56d5c2-aca7-4fd6-b2cc-272139641dc5))
(pad "5" smd rect (at -0.975 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ac465140-87d3-42c6-9782-113da4099189))
(pad "6" smd rect (at -0.325 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6e67919c-cc47-49a5-8383-402890559347))
(pad "7" smd rect (at 0.325 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b2bfb99f-370e-4bfe-9162-b0fc43a1c3b8))
(pad "8" smd rect (at 0.975 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c1590392-41f9-4ed9-96cc-1e05170f00bc))
(pad "9" smd rect (at 1.8125 0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fbde2239-7eab-4ce2-b95c-d67d840104cf))
(pad "10" smd rect (at 1.8125 0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp adfe7ca5-9a80-42da-bc1e-eeb2051a9417))
(pad "11" smd rect (at 1.8125 -0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c3df8878-5a9a-4507-a512-a7630136e9ee))
(pad "12" smd rect (at 1.8125 -0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 854a4e76-ae88-4be2-9811-b1b74e41b6e4))
(pad "13" smd rect (at 0.975 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a29061a1-d2ae-4e18-a089-c225d98a5d05))
(pad "14" smd rect (at 0.325 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 978bf96f-08ae-4a46-85c2-1d7b8effb0bf))
(pad "15" smd rect (at -0.325 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7909aef7-294f-4694-a042-88fd5934cfff))
(pad "16" smd rect (at -0.975 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36a5b41a-76c6-48b0-9d92-8c7a969065f0))
(pad "17" smd rect (at 0.5375 0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 3922dda6-6efa-4652-bc9d-57feef60f59e))
(pad "17" smd rect (at -0.5375 -0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 3bfde717-089e-4828-83be-96b6f1ffa236))
(pad "17" smd rect (at 0.5375 -0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 3e563b46-0bca-4bd9-ae40-18cf98ef354f))
(pad "17" smd rect (at -0.5375 0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 520afa04-e89c-47ee-b746-52bf2d52f3b6))
(model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_4x4mm_Pitch0.65mm.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)